Contact structures and methods for making same
First Claim
Patent Images
1. A method of forming a contact structure, said method comprising:
- building a core structure on a substrate, said core structure defining a desired shape of said contact structure; and
over coating at least a portion of said core structure,wherein said over coat comprises a material that is one of harder or has a greater yield strength than a material of said core structure.
1 Assignment
0 Petitions
Accused Products
Abstract
Contact structures are formed by building a core structure on a substrate and over coating the core structure with a material that is harder or has a greater yield strength than the material of the core structure. The core structure may be formed by attaching a wire to the substrate and spooling the wire out from a spool. While spooling the wire out, the spool may be moved to impart a desired shape to the wire. The wire is severed from the spool and over coated. As an alternative, the wire is not over coated. The substrate may be an electronic device, such as a semiconductor die.
247 Citations
25 Claims
-
1. A method of forming a contact structure, said method comprising:
-
building a core structure on a substrate, said core structure defining a desired shape of said contact structure; and over coating at least a portion of said core structure, wherein said over coat comprises a material that is one of harder or has a greater yield strength than a material of said core structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
2. A method claim 1, wherein said building step comprising:
-
attaching a wire to said substrate; spooling out said wire; and severing said wire.
-
-
3. The method of claim 2, wherein said spooling step comprises spooling out said wire in said desired shape of said contact structure.
-
4. The method of claim 3, wherein said spooling step further comprises moving a spool from which said wire is spooled in said desired shape of said contact structure.
-
5. The method of claim 4, wherein said moving step comprises moving said spool horizontally and vertically with respect to said substrate.
-
6. The method of claim 3, wherein said desired shape comprises at least one reversal of direction.
-
7. The method of claim 2, wherein said attaching step comprises bonding an end of said wire to said substrate.
-
8. The method of claim 2, wherein said substrate comprises a terminal and said attaching step comprises attaching said wire to said terminal.
-
9. The method of claim 8, wherein:
-
said substrate comprises a plurality of terminals, and said method further comprises repeating said attaching, spooling, severing, and over coating steps a plurality of times and thereby forming a plurality of contact structures on said plurality of terminals.
-
-
10. The method of claim 1, wherein said material of said over coat is harder than said material of said core structure.
-
11. The method of claim 1, wherein said material of said over coat has a greater yield strength than said material of said core structure.
-
12. The method of claim 1, wherein said substrate is a semiconductor device.
-
13. The method of claim 12, wherein said semiconductor device is a singulated die.
-
14. The method of claim 13, wherein said die is unpackaged.
-
15. The method of claim 12, wherein said semiconductor device is a die of an unsingulated semiconductor wafer.
-
16. The method of claim 1, wherein said building step comprises one of forming, creating, or disposing said core structure on said substrate.
-
2. A method claim 1, wherein said building step comprising:
-
-
17. A method of forming a contact structure, said method comprising:
-
attaching a wire to a surface of a substrate; spooling out said wire from a spool; while spooling out said wire, moving said spool in a motion that comprises both a vertical movement and a horizontal movement with respect to said surface of said substrate to impart a desired shape of said contact structure to said wire; and severing said wire. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25)
-
18. The method of claim 17, wherein said shape comprises at least one reversal of direction.
-
19. The method of claim 17, wherein said attaching step comprises bonding an end of said wire to said substrate.
-
20. The method of claim 17, wherein said surface of said substrate comprises a terminal and said attaching step comprises attaching said wire to said terminal.
-
21. The method of claim 19, wherein:
-
said surface of said substrate comprises a plurality of terminals, and said method further comprises repeating said attaching, spooling, moving, and severing steps a plurality of times and thereby forming a plurality of contact structures on said plurality of terminals.
-
-
22. The method of claim 19, wherein said substrate is a semiconductor device.
-
23. The method of claim 21, wherein said semiconductor device is a singulated die.
-
24. The method of claim 22, wherein said die is unpackaged.
-
25. The method of claim 21, wherein said semiconductor device is a die of an unsingulated semiconductor wafer.
-
18. The method of claim 17, wherein said shape comprises at least one reversal of direction.
-
Specification
- Resources
Thank you for your request. You will receive a custom alert email when the Litigation Campaign Assessment is available.
×
-
Current AssigneeFormFactor Incorporated
-
Original AssigneeFormFactor Incorporated
-
InventorsKhandros, Igor Y.
-
Primary Examiner(s)Arbes, Carl J.
-
Application NumberUS10/938,267Publication NumberTime in Patent Office690 DaysField of Search298/43, 298/42, 298/79, 298/25, 298/44, 228/180.5US Class Current29/842CPC Class CodesB23K 1/0016 Brazing of electronic compo...B23K 2101/40 Semiconductor devicesC23C 18/161 from plating step, e.g. inkjetC25D 7/12 SemiconductorsC25D 7/123 Semiconductors first coated...G01R 1/0466 concerning contact pieces o...G01R 1/06711 Probe needles; Cantilever b...G01R 1/06761 related to layersG01R 1/07307 with individual probe eleme...G01R 3/00 Apparatus or processes spec...G01R 31/2884 using dedicated test connec...G01R 31/2886 Features relating to contac...H01L 21/4853 Connection or disconnection...H01L 21/563 Encapsulation of active fac...H01L 21/6715 Apparatus for applying a li...H01L 21/76897 Formation of self-aligned v...H01L 22/20 Sequence of activities cons...H01L 2224/10126 Bump collarH01L 2224/10145 Flow barriersH01L 2224/1134 Stud bumping, i.e. using a ...H01L 2224/13099 : MaterialH01L 2224/13111 : Tin [Sn] as principal const...H01L 2224/29099 : MaterialH01L 2224/32225 : the item being non-metallic...H01L 2224/45015 : being circularH01L 2224/45109 : Indium (In) as principal co...H01L 2224/45111 : Tin (Sn) as principal const...H01L 2224/45116 : Lead (Pb) as principal cons...H01L 2224/45117 : the principal constituent m...H01L 2224/4512 : Antimony (Sb) as principal ...H01L 2224/45123 : Magnesium (Mg) as principal...H01L 2224/45124 : Aluminium (Al) as principal...H01L 2224/45138 : the principal constituent m...H01L 2224/45139 : Silver (Ag) as principal co...H01L 2224/45144 : Gold (Au) as principal cons...H01L 2224/45147 : Copper (Cu) as principal co...H01L 2224/45155 : Nickel (Ni) as principal co...H01L 2224/45163 : the principal constituent m...H01L 2224/45164 : Palladium (Pd) as principal...H01L 2224/45169 : Platinum (Pt) as principal ...H01L 2224/45173 : Rhodium (Rh) as principal c...H01L 2224/45176 : Ruthenium (Ru) as principal...H01L 2224/4554 : CoatingH01L 2224/4556 : Disposition, e.g. coating o...H01L 2224/456 : with a principal constituen...H01L 2224/4809 : Loop shapeH01L 2224/48091 : ArchedH01L 2224/4813 : Connecting within a semicon...H01L 2224/48227 : connecting the wire to a bo...H01L 2224/48465 : the other connecting portio...H01L 2224/49109 : outside the semiconductor o...H01L 2224/73203 : Bump and layer connectorsH01L 2224/73265 : Layer and wire connectorsH01L 2224/78301 : CapillaryH01L 2224/81205 : Ultrasonic bondingH01L 2224/81801 : Soldering or alloyingH01L 2224/85043 : using a flame torch, e.g. h...H01L 2224/85045 : using a corona discharge, e...H01L 2224/85201 : Compression bondingH01L 2224/85205 : Ultrasonic bondingH01L 23/49811 : Additional leads joined to ...H01L 24/11 : Manufacturing methods for b...H01L 24/13 : of an individual bump conne...H01L 24/16 : of an individual bump conne...H01L 24/29 : of an individual layer conn...H01L 24/45 : of an individual wire conne...H01L 24/48 : of an individual wire conne...H01L 24/49 : of a plurality of wire conn...H01L 24/72 : Detachable connecting means...H01L 24/81 : using a bump connectorH01L 25/0652 : the devices being arranged ...H01L 25/16 : the devices being of types ...H01L 2924/00 : Indexing scheme for arrange...H01L 2924/00012 : Relevant to the scope of th...H01L 2924/00013 : Fully indexed contentH01L 2924/00014 : the subject-matter covered ...H01L 2924/00015 : the subject-matter covered ...H01L 2924/01005 : Boron [B]H01L 2924/01011 : Sodium [Na]H01L 2924/01012 : Magnesium [Mg]H01L 2924/01013 : Aluminum [Al]H01L 2924/01014 : Silicon [Si]H01L 2924/01015 : Phosphorus [P]H01L 2924/0102 : Calcium [Ca]H01L 2924/01022 : Titanium [Ti]H01L 2924/01024 : Chromium [Cr]H01L 2924/01027 : Cobalt [Co]H01L 2924/01028 : Nickel [Ni]H01L 2924/01029 : Copper [Cu]H01L 2924/0103 : Zinc [Zn]H01L 2924/01031 : Gallium [Ga]H01L 2924/01033 : Arsenic [As]H01L 2924/01039 : Yttrium [Y]H01L 2924/01042 : Molybdenum [Mo]H01L 2924/01044 : Ruthenium [Ru]H01L 2924/01045 : Rhodium [Rh]H01L 2924/01046 : Palladium [Pd]H01L 2924/01047 : Silver [Ag]H01L 2924/01049 : Indium [In]H01L 2924/0105 : Tin [Sn]H01L 2924/01051 : Antimony [Sb]H01L 2924/0106 : Neodymium [Nd]H01L 2924/01074 : Tungsten [W]H01L 2924/01078 : Platinum [Pt]H01L 2924/01079 : Gold [Au]H01L 2924/01082 : Lead [Pb]H01L 2924/0132 : Binary AlloysH01L 2924/01322 : Eutectic Alloys, i.e. obtai...H01L 2924/01327 : Intermediate phases, i.e. i...H01L 2924/014 : Solder alloysH01L 2924/10253 : Silicon [Si]H01L 2924/10329 : Gallium arsenide [GaAs]H01L 2924/15153 : the die mounting substrate ...H01L 2924/1517 : Multilayer substrateH01L 2924/15312 : being a pin array, e.g. PGAH01L 2924/1532 : the connection portion bein...H01L 2924/15787 : Ceramics, e.g. crystalline ...H01L 2924/16152 : Cap comprising a cavity for...H01L 2924/16195 : Flat cap [not enclosing an ...H01L 2924/19041 : being a capacitorH01L 2924/19043 : being a resistorH01L 2924/19107 : off-chip wiresH01L 2924/2075 : larger or equal to 1 micron...H01L 2924/20751 : larger or equal to 10 micro...H01L 2924/20752 : larger or equal to 20 micro...H01L 2924/20753 : larger or equal to 30 micro...H01L 2924/20754 : larger or equal to 40 micro...H01L 2924/20755 : larger or equal to 50 micro...H01L 2924/20756 : larger or equal to 60 micro...H01L 2924/20757 : larger or equal to 70 micro...H01L 2924/20758 : larger or equal to 80 micro...H01L 2924/20759 : larger or equal to 90 micro...H01L 2924/2076 : equal to or larger than 100...H01L 2924/30107 : InductanceH01L 2924/3011 : ImpedanceH01L 2924/3025 : Electromagnetic shieldingH01L 2924/3512 : CrackingH01R 12/52 : connecting to other rigid p...H05K 1/141 : One or more single auxiliar...H05K 2201/0397 : Tab forming integral conduc...H05K 2201/068 : wherein the coefficient of ...H05K 2201/1031 : Surface mounted metallic co...H05K 2201/10318 : Surface mounted metallic pinsH05K 2201/10378 : InterposersH05K 2201/10719 : Land grid array [LGA]H05K 2201/10734 : Ball grid array [BGA]; Bump...H05K 2201/10757 : Bent leadsH05K 2201/10878 : Means for retention of a le...H05K 2201/10909 : Materials of terminal, e.g....H05K 2201/10946 : Leads attached onto leadles...H05K 3/308 : Adaptations of leads connec...H05K 3/326 : the printed circuit having ...H05K 3/3421 : Leaded componentsH05K 3/3426 : characterised by the leadsH05K 3/368 : parallel to each other H05K...H05K 3/4015 : using auxiliary conductive ...H05K 3/4092 : Integral conductive tabs, i...H05K 7/1069 : with spring contact piecesY02P 70/50 : Manufacturing or production...Y10T 29/49144 : by metal fusionY10T 29/49147 : Assembling terminal to baseY10T 29/49149 : by metal fusion bondingY10T 29/49151 : by deforming or shapingY10T 29/49155 : Manufacturing circuit on or...Y10T 29/49174 : Assembling terminal to elon...Y10T 29/49179 : by metal fusion bondingY10T 29/49204 : Contact or terminal manufac...Y10T 29/49222 : forming array of contacts o...Y10T 29/49224 : with coatingY10T 29/49609 : Spring making