Strain sensor having improved accuracy

• US 7,082,844 B1
• Filed: 02/16/2005
• Issued: 08/01/2006
• Est. Priority Date: 02/16/2005
• Status: Expired due to Fees

• Current Assignee: CTS Corporation
• Original Assignee: CTS Corporation
• Inventors: Bloom, Terry R., Cook, Kim D.
• Primary Examiner(s): Noori, Max
• Assistant Examiner(s): Davis, Octavia
• Application Number:
  US11/058,480
• Publication Number:
  US 20060179957A1
• Time in Patent Office: 531 Days
• Field of Search: None
• US Class Current: 73/862.041
• CPC Class Codes: G01L 1/2231 the supports being disc- or ring-shaped, adapted for measuring a force along a single direction

Abstract

A strain sensor that is suited for use as an occupant weight sensor in a vehicle seat is disclosed. The strain sensor includes a substrate having a top surface and a bottom surface. Several bumps are located on the top surface. The bumps extend above the top surface. The bumps are arranged in a pattern. A dielectric material is located on the top surface. At least one strain sensitive resistor is located on the dielectric material. Several conductive traces are formed on the dielectric material and are electrically connected with the strain sensitive resistor.

Claims

1. A strain sensor comprising:

a load carrying member having a top and bottom surface and an outer peripheral edge;

at least three bumps formed on the top surface and located toward the outer peripheral edge;

a housing, the load carrying member mounted adjacent the housing such that the bumps are adapted to contact the housing;

at least one layer of dielectric material formed on the top surface;

at least one strain sensitive resistor formed on the dielectric material; and

the bumps providing a planar contact between the housing and the load carrying member.

2. The strain sensor of claim 1, further comprising:

at least one conductive trace formed on the dielectric material, the conductive trace providing an electrical connection to the strain sensitive resistor.

3. The strain sensor of claim 2, further comprising:

a connection pad formed on the dielectric material, the conductive trace electrically connected to the connection pad.

4. The strain sensor of claim 1 wherein a portion of the bumps have an angular separation between 12 and 60 degrees.

5. A strain sensor comprising:

a substrate having a top surface and a bottom surface;

a plurality of bumps located on the top surface, the bumps extending above the top surface, the bumps further being arranged in a pattern, the bumps being adapted to form a planar contact between a housing and the substrate when a load is applied to the housing;

a dielectric material located on the top surface;

at least one strain sensitive resistor located on the dielectric material; and

a plurality of conductive traces formed on the dielectric material and electrically connected with the strain sensitive resistor.

6. The strain sensor of claim 5, wherein the bumps are arranged about an outer peripheral edge of the substrate.

7. The strain sensor of claim 5 wherein at least a portion of the bumps have an angular separation between 12 and 60 degrees.

8. The strain sensor of claim 5 wherein the substrate has a central raised portion, the bumps being arranged around the central raised portion.

9. The strain sensor of claim 8, wherein the resistor is mounted on the central raised portion.

10. The strain sensor of claim 5, wherein the strain sensor is mounted in a vehicle seat.

11. A strain sensor comprising:

a substrate having a top and bottom surface;

a central raised portion defined on the top surface of the substrate;

at least two bumps formed on the top surface of the substrate, the bumps located outside of the central raised portion and toward an outer peripheral edge of the substrate;

at least one layer of dielectric material formed on the central raised portion;

at least one strain sensitive resistor formed on the dielectric material, the strain sensitive resistor being adapted to change resistance in response to an applied load; and

the substrate configured to be mounted adjacent a housing such that the bumps are adapted to contact the housing and form a planar contact between the housing and the substrate.

12. The strain sensor of claim 11, wherein a recess is located on the bottom surface of the substrate.

13. The strain sensor of claim 12, wherein the recess is located below the central portion.

14. The strain sensor of claim 12, wherein the recess is adapted to mate with a ball.