Semiconductor device having resin-sealed area on circuit board thereof

• US 7,084,511 B2
• Filed: 03/27/2002
• Issued: 08/01/2006
• Est. Priority Date: 03/27/2001
• Status: Expired due to Fees

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: NEC Electronics Corporation (Renesas Electronics Corporation)
• Inventors: Matsuda, Shuichi
• Primary Examiner(s): Whitehead, Jr., Carl
• Assistant Examiner(s): Mitchell, James M.
• Application Number:
  US10/106,495
• Publication Number:
  US 20020140083A1
• Time in Patent Office: 1,588 Days
• Field of Search: 257/686, 257/711, 257/787, 257/778, 257/737, 257/666, 257/775, 438/126, 438/124, 438/127, 438/106, 361/736, 361/748, 361/760
• US Class Current: 257/775
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/4943 the connecting portions being staggered
• CPC Class Codes: H01L 2224/49431 on the semiconductor or solid-state body
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A semiconductor device having a molded sealing resin for sealing a semiconductor chip on a circuit board thereof reduces resin burrs resulting from the leakage of the sealing resin, and also restrains the occurrence of disconnection caused by a wiring layer being crushed. In the semiconductor device, the sealing resin for sealing the semiconductor chip is molded on the circuit board that has a plurality of wiring patterns and a solder resist for insulatively covering the wiring patterns formed on the front surface thereof, the interval of the wiring patterns is set to range from 50% to 200% of its adjacent interval in a molding line area of the sealing resin.

Claims

1. A semiconductor device comprising:

a circuit board;

a semiconductor chip mounted on said circuit board, said semiconductor chip including first, second and third electrodes;

first, second and third wiring patterns each including a pad which is electrically connected to a corresponding one of said first, second and third electrodes of said semiconductor chip and a conductive line elongated from the pad in a direction opposite to said semiconductor chip; and

a sealing resin formed to encapsulate said semiconductor chip together with the pad, a part of the conductive line of each of said first, second and third wiring patterns, and a part of said circuit board, said sealing resin having a molding line to define an outer edge thereof, the conductive line of said first, second and third wiring patterns thereby crossing said molding line of said sealing resin,

wherein the conductive line of said first wiring pattern is larger in width than the conductive line of each of said second and third wiring patterns at least at a crossing portion with said molding line so that a gap along said molding line of said sealing resin between said first and second wiring patterns is approximately equal to a gap along said molding line of said sealing resin between said second and third wiring patterns.

2. The device as claimed in claim 1, wherein said circuit board includes a heat spreader.

3. The device as claimed in claim 1, wherein each of said pad and said conductive line of each of said first, second and third wiring patterns is formed on a front surface of said circuit board, said circuit board further including a plurality of terminal electrodes formed on said front surface of said circuit board, said conductive line of each of said first, second and third wiring patterns being elongated from said pad of an associated one of said first, second and third wiring patterns and reaching an associated one of said terminal electrodes.

4. The device as claimed in claim 1, wherein each of said pad and said conductive line of each of said first, second and third wiring patterns is formed on a front surface of said circuit board, said circuit board including a plurality of terminal electrodes formed on a rear surface of said circuit board and a plurality of through holes, said conductive line of each of said first, second and third wiring patterns being elongated from said pad of an associated one of said terminal electrodes via an associated one of said through holes.

5. The semiconductor device as claimed in claim 1, wherein, said pads of said first, second and third wiring patterns are located at said part of said circuit board encapsulated by said sealing resin.

6. The semiconductor device of claim 5, wherein said circuit board has a plurality of wiring layers and a plurality of resin films.

7. The semiconductor device as claimed in claim 1, wherein, said circuit board comprises a wiring layer and a resin film.