Bimorph MEMS devices
First Claim
1. A microelectro-mechanical dimensioned bimorph structure comprising:
- a first MEMS sized deposited morphable element structure, made by a deposition process on a first substrate;
a second MEMS sized deposited morphable element structure, made by a deposition process on a second substrate; and
a bonding layer bonding the first element structure directly to the second element structure, the bonding layer being less than 10 μ
m in thickness and comprised of one of a nonconductive epoxy bonding material containing conductive particles, or nonconductive epoxy bonding material alone, both of which are ineffective for their intended purpose at temperatures reached in the preparation process used to make the deposited morphable element structure,wherein the bimorph structure is physically separate and apart from the first and second substrates on which the first element structure and the second element structure were deposited and formed respectively.
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Abstract
A micro-electromechanical dimensioned bimorph structure includes a first element layer structure, and a second element layer structure. The element layer structures are provided in various combinations, including piezoelectric/piezoelectric, antiferroelectric/antiferroelectric or antiferroelectric/piezoelectric. The layer thickness of the element structure is less than 100 μm. A bonding layer bonds the first element structure directly to the second element structure, and the bonding layer thickness is less than 10 μm. The bimorph structure can be made in various forms including a cantilever or a diaphragm. Microfluidic devices using the bimorph structures may also be constructed.
80 Citations
25 Claims
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1. A microelectro-mechanical dimensioned bimorph structure comprising:
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a first MEMS sized deposited morphable element structure, made by a deposition process on a first substrate; a second MEMS sized deposited morphable element structure, made by a deposition process on a second substrate; and a bonding layer bonding the first element structure directly to the second element structure, the bonding layer being less than 10 μ
m in thickness and comprised of one of a nonconductive epoxy bonding material containing conductive particles, or nonconductive epoxy bonding material alone, both of which are ineffective for their intended purpose at temperatures reached in the preparation process used to make the deposited morphable element structure,wherein the bimorph structure is physically separate and apart from the first and second substrates on which the first element structure and the second element structure were deposited and formed respectively. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 16, 19, 20, 21, 22)
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12. A microfluidic ejector comprising:
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a nozzle plate; a fluidic cavity body bonded to the nozzle plate; and a MEMS sized diaphragm bimorph actuator structure bonded to the cavity body, wherein the diaphragm bimorph actuator structure is configured from two layers of at least one of a sintered or annealed piezoelectric film and a sintered or annealed antiferroelectric film, and a structure bonding layer which bonds the sintered or annealed piezoelectric film or the sintered or annealed antiferroelectric film, the bonding layer comprised of at least one of a nonconductive epoxy bonding material with conductive particles or a nonconductive epoxy bonding material alone, both of which are ineffective for their intended purpose at temperatures required for generating either of the sintered or annealed piezoelectric film or the sintered or annealed antiferroelectric film, wherein the two layers of the bimorph actuator structure are each made by a deposition process on respective first substrate and second substrates, and wherein the microfluidic ejector is physically separate and apart from the first and second substrates on which the two layers were deposited and formed. - View Dependent Claims (13, 14, 15, 17, 18, 23, 24, 25)
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Specification