Electrically decoupled integrated transformer having at least one grounded electric shield
First Claim
1. An integrated circuit comprising a first layer bearing first metallization patterned for defining a first inductive coil, a second layer bearing second metallization patterned for defining a second inductive coil that overlies the first inductive coil and that is magnetically coupled to the first inductive coil through a third layer interposed between the first layer and the second layer, said third layer bearing third metallization for defining an electric shield, the third metallization being patterned into a plurality of structures having shapes intended to minimize eddy currents and being connected to further metallization that carries a ground potential.
3 Assignments
0 Petitions
Accused Products
Abstract
An integrated circuit, such as a radio frequency integrated circuit (RFIC), has a first layer bearing first metallization patterned for defining a first inductive coil, a second layer bearing second metallization patterned for defining a second inductive coil that overlies the first inductive coil and that is magnetically coupled to the first inductive coil through a third layer interposed between the first layer and the second layer. The third layer bears third metallization for defining an electric shield or electrostatic shield. The third metallization is patterned into a plurality of structures having shapes intended to minimize eddy currents. The electric shield is connected to further metallization that carries a ground potential. The third layer may further bear other metallization for coupling together at least two components of the integrated circuit. The integrated circuit may be fabricated by a CMOS process, and the first and second coils may be a primary coil and a secondary coil, respectively, of a radio frequency transformer. An additional electric shield may also be included, and in this case one electric shield can be coupled to a ground potential associated with the primary coil, and the second electric shield can be coupled to a ground potential associated with the secondary coil.
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Citations
28 Claims
- 1. An integrated circuit comprising a first layer bearing first metallization patterned for defining a first inductive coil, a second layer bearing second metallization patterned for defining a second inductive coil that overlies the first inductive coil and that is magnetically coupled to the first inductive coil through a third layer interposed between the first layer and the second layer, said third layer bearing third metallization for defining an electric shield, the third metallization being patterned into a plurality of structures having shapes intended to minimize eddy currents and being connected to further metallization that carries a ground potential.
- 11. A radio frequency integrated circuit (RFIC) comprising a first layer bearing first metallization patterned for defining a primary coil of at least one transformer, a second layer bearing second metallization patterned for defining a secondary coil of the at least one transformer, one of the primary or the secondary coil overlying the other one of the secondary or primary coil and being magnetically coupled thereto through a third layer interposed between the first layer and the second layer, said third layer bearing third metallization for defining an electrostatic shield for the at least one transformer, the third metallization being patterned into a plurality of structures having shapes intended to minimize eddy currents and being connected to further metallization that carries a ground potential, where said third layer further bears other metallization for coupling together at least two components of said RFIC.
- 23. A radio frequency integrated circuit (RFIC) comprising a first layer bearing first electrically conductive material patterned for defining a primary coil of at least one transformer, a second layer bearing second electrically conductive material patterned for defining a secondary coil of the at least one transformer, one of the primary or the secondary coil overlying the other one of the secondary or primary coil and being magnetically coupled thereto through a third layer interposed between the first layer and the second layer, said third layer bearing third electrically conductive material for defining at least one electric shield for the at least one transformer, the third electrically conductive material being patterned into a plurality of structures having shapes intended to minimize eddy currents and being connected to further electrically conductive material that carries a ground potential.
Specification