Semiconductor curing light system useful for curing light activated composite materials

• US 7,086,858 B2
• Filed: 12/13/2001
• Issued: 08/08/2006
• Est. Priority Date: 09/24/1999
• Status: Expired due to Term

• Current Assignee: CAO Group, Inc.
• Original Assignee: CAO Group, Inc.
• Inventors: Cao, Densen
• Primary Examiner(s): Lewis, Ralph A.
• Application Number:
  US10/017,454
• Publication Number:
  US 20020115037A1
• Time in Patent Office: 1,699 Days
• Field of Search: 433/29, 433/215, 606/1, 606/13, 606/16, 607/88, 362/119, 362/800, 362/804
• US Class Current: 433/29
• CPC Class Codes: A61C 19/004 Hand-held apparatus, e.g. guns
• CPC Class Codes: A61N 2005/0652 Arrays of diodes
• CPC Class Codes: B23K 26/0096 Portable laser equipment, e.g. hand-held laser apparatus surgical laser instruments A61B18/20, Dental Lasers A61C1/0046, Hand-held laser dental apparatus for curing resins A61C19/004
• CPC Class Codes: B23K 26/064 by means of optical elements, e.g. lenses, mirrors or prisms
• CPC Class Codes: B23K 26/0643 comprising mirrors
• CPC Class Codes: B23K 26/0648 comprising lenses
• CPC Class Codes: B23K 26/0665 by beam condensation on the workpiece, e.g. for focusing
• CPC Class Codes: B23K 26/703 Cooling arrangements by using a fluid stream B23K26/14

Abstract

A curing light system useful for curing light activated composite materials is disclosed. The system includes a light emitting semiconductor device, a primary heat sink and a secondary heat sink. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.

Claims

1. A curing light comprising:

a light module,

said light module including an elongate heat sink with a proximal end and a distal end, said elongate heat sink havinga longitudinal axis,

a mounting platform located at said elongate heat sink distal end, said mounting platform being adapted to have a LED chip module mounted thereon, and

an LED chip module mounted on said mounting platform, said LED chip module including

a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink,

a well on said primary heat sink for mounting an LED chip therein,

an LED chip mounted in said well,

wherein said LED chip module is mounted on said mounting platform; and

wherein said mounting platform is positioned so light emitted by said LED chip module directly forward of said LED chip module travels away from said LED chip module at an angular orientation in the range of 30 to 150 degrees;

with respect to said elongate heat sink longitudinal axis and wherein light emitted by the curing light travels away from the curing light at an angular orientation in the range of 30 to 150 degrees with respect to said elongate heat sink longitudinal axis; and

wherein said light exits the curing light and travels to a location where it can cure a light-curable material without passing through a light guide.

2. A curing light comprising:

an elongate heat sink with a proximal end and a distal end, said elongate heat sink having a longitudinal axis defined between said proximal end and said distal end,

an LED chip module mounted at said elongate heat sink distal end, said LED chip module including

a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink, and

an LED chip mounted to said primary heat sink;

wherein said LED chip module is mounted on said mounting platform in a position so that light emitted by said LED chip module directly forward of said LED chip module travels away from said LED chip module at an angle in the range of 45 to 135 degrees with respect to said elongate heat sink longitudinal axis;

wherein said light exits the curing light and travels to a location where it can cure a light-curable material without passing through a light guide.

3. A curing light as recited in claim 2 further comprising a well on said primary heat sink wherein said LED chip is mounted.

4. A curing light comprising:

an elongate heat sink having a longitudinal axis,

a semiconductor chip capable of emitting light that can aid in initiating curing of a curable material,

wherein said semiconductor chip is fixedly mounted with respect to said elongate heat sink so that light emitted by said semiconductor chip directly forward of said semiconductor chip departs said semiconductor chip at an angle with respect to said elongate heat sink longitudinal axis in the range of 30 to 150 degrees; and

wherein said light travels to the exterior of the curing light and travels to a location where it can cure a light-curable material without passing through a light guide.