Stiction resistant release process
First Claim
Patent Images
1. A method of releasing a micro-electronic device formed over an insulator of a silicon-on-insulator (SOI) substrate, comprising:
- etching at least a portion of the insulator to separate the micro-electronic device from the SOI substrate;
rinsing at least the micro-electronic device; and
exposing at least the micro-electronic device to a micro-sphere solution comprising a plurality of micro-spheres each having a diameter no less than about 0.1 μ
m.
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Abstract
A method of releasing a micro-electronic device formed over an insulator of a silicon-on-insulator (SOI) substrate. In one embodiment, the release method includes etching at least a portion of the insulator to separate the micro-electronic device from the SOI substrate, rinsing at least the micro-electronic device, exposing at least the micro-electronic device to a micro-sphere solution and removing the micro-electronic device from the SOI substrate. The release method may also include exposing the micro-electronic device to an etching plasma to substantially expunge the micro-sphere solution.
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Citations
24 Claims
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1. A method of releasing a micro-electronic device formed over an insulator of a silicon-on-insulator (SOI) substrate, comprising:
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etching at least a portion of the insulator to separate the micro-electronic device from the SOI substrate; rinsing at least the micro-electronic device; and exposing at least the micro-electronic device to a micro-sphere solution comprising a plurality of micro-spheres each having a diameter no less than about 0.1 μ
m. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of manufacturing a micro-electronic device, comprising:
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providing a substrate having an insulator layer located over a bulk substrate and a device layer located over the insulator layer; forming a micro-electronic device in the device layer; etching the insulator layer to separate the micro-electronic device from the bulk substrate; rinsing at least the micro-electronic device; and exposing at least the micro-electronic device to a micro-sphere solution comprising a plurality of micro-spheres each having a diameter no less than about 0.1 μ
m. - View Dependent Claims (19, 20, 21, 22, 23, 24)
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Specification