Post-CMP washing liquid composition
First Claim
1. A post-OMP washing liquid composition consisting of one type or two or more types of aliphatic polycarboxylic acids and one type or two or more types selected from the group consisting of glyoxylic acid, ascorbic acid, glucose, fructose, lactose, and mannose, the washing liquid composition having a pH of less than 3.0.
3 Assignments
0 Petitions
Accused Products
Abstract
A post-CMP washing liquid composition is provided which includes one type or two or more types of aliphatic polycarboxylic acids and one type or two or more types selected from the group consisting of glyoxylic acid, ascorbic acid, glucose, fructose, lactose, and mannose, and which has a pH of less than 3.0. This washing liquid has excellent performance in removing micro particles and metal impurities adhering to the surface of a semiconductor substrate after CMP and does not corrode a metal wiring material.
25 Citations
5 Claims
- 1. A post-OMP washing liquid composition consisting of one type or two or more types of aliphatic polycarboxylic acids and one type or two or more types selected from the group consisting of glyoxylic acid, ascorbic acid, glucose, fructose, lactose, and mannose, the washing liquid composition having a pH of less than 3.0.
-
4. A post-CMP washing liquid composition consisting of one type or two or more types of aliphatic polycarboxylic acids, one type or two or more types selected from the group consisting of glyoxylic acid, ascorbic acid, glucose, fructose, lactose, and mannose and a surfactant, the washing liquid composition having a pH of less than 3.0.
Specification