Test arrangement for testing semiconductor circuit chips
First Claim
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1. A test system for testing semiconductor circuit chips comprising:
- a primary test channel;
a plurality of parallel subchannels, each subchannel configured to have a first end coupled to the primary test channel and a second end configured to be coupled to an input of separate semiconductor chips under test; and
a buffering circuit arranged in each subchannel, wherein the buffering circuit comprises a field effect transistor and a pull-up resistor, the field effect transistor including a first electrode connected to a first end of the pull-up resistor and to the input of the separate semiconductor chip under test, and the pull-up resistor including a second end connected to at least one voltage source.
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Abstract
The invention relates to a test arrangement for testing semiconductor circuit chips, in which a test signal received via a primary test channel from a driver amplifier of an item of test equipment is distributed via parallel sub-channels to a plurality of inputs of one or more semiconductor circuit chips under test the test arrangement having signal buffering circuits arranged in each sub-channel that receive and buffer the test signal from the driver amplifier before feeding it to the inputs of the semiconductor circuit chip(s).
28 Citations
20 Claims
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1. A test system for testing semiconductor circuit chips comprising:
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a primary test channel; a plurality of parallel subchannels, each subchannel configured to have a first end coupled to the primary test channel and a second end configured to be coupled to an input of separate semiconductor chips under test; and a buffering circuit arranged in each subchannel, wherein the buffering circuit comprises a field effect transistor and a pull-up resistor, the field effect transistor including a first electrode connected to a first end of the pull-up resistor and to the input of the separate semiconductor chip under test, and the pull-up resistor including a second end connected to at least one voltage source. - View Dependent Claims (2, 3, 4, 5)
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6. A test system for testing semiconductor circuit chips comprising:
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a primary test channel; a plurality of parallel subchannels, each subchannel configured to have a first end coupled to the primary test channel and a second end configured to be coupled to an input of separate semiconductor chips under test; and a buffering circuit arranged in each subchannel, each buffering circuit including a field effect transistor and a pull-up resistor; and a driver amplifier coupled to the primary channel for receiving a test signal for the test system, wherein a gate electrode of each field effect transistor is connected in common to the drive amplifier and a drain or source electrode of each field effect transistor is connected to one end of an associated pull-up resistor and the other end of the associated pull-up resistor is connected to at least one voltage source. - View Dependent Claims (7, 8, 9)
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10. A test arrangement for testing semiconductor circuit chips, the test arrangement comprising:
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a first test system comprising a first primary test channel, a plurality of parallel subchannels, each subchannel configured to have a first end coupled to the first primary test channel and a second end configured to be coupled to an input of a first set of separate semiconductor chips under test, a buffering circuit arranged in each subchannel, each buffering circuit including a field effect transistor and a pull-up resistor, and a first driver amplifier coupled to the first primary channel for receiving a first test signal, wherein a gate electrode of each field effect transistor is connected in common to the first drive amplifier; and a second test system comprising a second primary test channel, a plurality of parallel sub channels, each subchannel configured to have a first end coupled to the second primary test channel and a second end configured to be coupled to an input of a second set of separate semiconductor chips under test, a buffering circuit arranged in each subchannel, each buffering circuit including a field effect transistor and a pull-up resistor, and a second driver amplifier coupled to the first primary channel for receiving a first test signal, wherein a gate electrode of each field effect transistor is connected in common to the second drive amplifier; wherein one end of each of the pull-up resistors is connected to a freely selectable voltage source. - View Dependent Claims (11, 12)
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13. A test arrangement for testing semiconductor circuit chips comprising:
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a primary test channel for receiving a test signal from a driver amplifier of an item of test equipment; a plurality of parallel sub-channels for distributing the test signal to a plurality of inputs of one or more semiconductor circuit chips under test; a signal buffering circuit arranged in each sub-channel to receive and buffer the test signal from the driver amplifier before feeding it to the inputs of the semiconductor circuit chip(s), wherein all the signal buffering circuits have the same circuit arrangement and each includes a field effect transistor and a pull-up resistor, and where the drain or source electrode of each field effect transistor is connected to one end of the associated pull-up resistor and to the respective chip input via the associated sub-channel, the gate electrodes of the field effect transistors are connected in common to the driver amplifier, and the other electrodes of the drain and source electrodes of the field effect transistors that are not connected to the pull-up resistor are connected in common to ground, and the other ends of the pull-up resistors are connected to at least one voltage source. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification