Yokeless hidden hinge micromirror device with double binge layer
First Claim
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1. An array of micromirror pixel elements, comprising:
- a semiconductor substrate layer having circuitry for controlling the operation of the pixel elements;
a mirror layer having a mirror associated with each pixel element;
a hinge layer spaced between the mirror layer and the substrate layer, the hinge layer having a torsion hinge under each mirror and attached to the mirror such that the mirror may tilt above the hinge layer;
a raised electrode layer spaced between the hinge layer and the substrate layer and having at least one raised electrode; and
an address electrode layer spaced between the raised electrode layer and the substrate.
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Abstract
A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of four operating layers 12, 13, 14, 15. An addressing layer 12 is fabricated on the substrate. A raised electrode layer 13 is spaced above the addressing layer by an air gap. A hinge layer 14 is spaced above the raised electrode layer 13 by another air gap. A mirror layer 15 is spaced over the hinge layer 14 by a third air gap.
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15 Claims
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1. An array of micromirror pixel elements, comprising:
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a semiconductor substrate layer having circuitry for controlling the operation of the pixel elements; a mirror layer having a mirror associated with each pixel element; a hinge layer spaced between the mirror layer and the substrate layer, the hinge layer having a torsion hinge under each mirror and attached to the mirror such that the mirror may tilt above the hinge layer; a raised electrode layer spaced between the hinge layer and the substrate layer and having at least one raised electrode; and an address electrode layer spaced between the raised electrode layer and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification