Methods of manufacturing a printed circuit board shielded against interfering radiation

• US 7,089,646 B2
• Filed: 10/03/2001
• Issued: 08/15/2006
• Est. Priority Date: 10/06/2000
• Status: Expired due to Term

• Current Assignee: Stork Prints BV
• Original Assignee: Stork Prints BV
• Inventors: Blankenborg, Stephanus Gerardus, Leerkamp, Peter
• Primary Examiner(s): Ngo, Hung V.
• Application Number:
  US10/398,497
• Publication Number:
  US 20040022046A1
• Time in Patent Office: 1,777 Days
• Field of Search: 174/35.R, 174/35.GC, 361/816, 361/818, 228/180.21, 228/179.1, 298/30, 298/32, 295/921
• US Class Current: 29/592.1
• CPC Class Codes: H05K 3/363 by soldering
• CPC Class Codes: H05K 9/003 made from non-conductive materials comprising an electro-conductive coating H05K9/0031 takes precedence
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

Methods for the production of a board (11) with printed circuit (12) shielded against interfering radiation and having electronic components (14) comprise the steps of positioning of the electronic components (14) on contact points (15) designed for them, and the application of a shield (20), comprising a preformed metallized plastic film (30) over the top of the electronic components (14) and in electrical contact with the earth (13) on the board (11) with printed circuit (12), and also fixing the electronic components (14) on the board (11) with printed circuit (12) by means of an electrically conducting fixing agent (16); and fixing of the shield (20) on the board (11) with printed circuit (12).

Claims

1. Method for the production of a board with printed circuit shielded against interfering radiation and having at least one electronic component, which method comprises the following steps:

a) the positioning and fixing of the at least one electronic component on contact points concerned of the board with printed circuit;

b) the positioning of a shield, comprising a preformed metallized plastic film, over the top of the electronic component on the earth of the board with printed circuit, the shield being a substantially box-shaped element, the side wall of which is provided with a fixing edge extending parallel to the main surface of the board, which fixing edge is provided with through apertures; and

c) the fixing of the shield on the earth of the board with printed circuit by applying a fixing agent over the fixing edge and on the board with printed circuit by way of the apertures.

2. Method according to claim 1, wherein the fixing agent is single-sided adhesive tape.

3. Method according to claim 1, wherein the steps a) and b) are carried out with a so-called pick-and-place device.

4. Method according to claim 1, wherein the plastic of the metallized plastic film is a temperature-resistant materials.

5. Method according to claim 4, wherein the temperature-resistant material is selected from a group consisting of polyimide, PC, PEEK, PES, polyamide or mixtures thereof.

6. Method according to claim 1, wherein the metal of the metallized plastic film is selected from Sn, Ni, Cu, Pb, alloys and mixtures thereof.

7. Method according to claim 6, wherein the metal comprises tin, lead or an alloy thereof.