Please download the dossier by clicking on the dossier button x
×

Optimized multiple heat pipe blocks for electronics cooling

  • US 7,090,001 B2
  • Filed: 05/16/2003
  • Issued: 08/15/2006
  • Est. Priority Date: 01/31/2003
  • Status: Expired due to Term
First Claim
Patent Images

1. An apparatus for removing heat from a heat generating device comprising a plate thermally coupled to the heat generating device and thermally coupled to two heat pipes wherein the thermal distances relative to the heat generating device are not the same and wherein each heat pipe is configured to have a predetermined boiling point temperature selected according to design criteria and thermal distance position relative to the heat generating device whereby the boiling point temperatures are not the same, to achieve substantially simultaneous onset of boiling within the two heat pipes in response to heat energy from the heat generating device.

View all claims
  • 11 Assignments
Timeline View
Assignment View
    ×
    ×