Single phase fluid imprint lithography method

• US 7,090,716 B2
• Filed: 10/02/2003
• Issued: 08/15/2006
• Est. Priority Date: 10/02/2003
• Status: Expired due to Term

• Current Assignee: Mii Newco, Inc. (Canon Inc.), Board of Regents of the University of Texas System (University of Texas System)
• Original Assignee: Molecular Imprints, Inc. (Canon Inc.), Board of Regents of the University of Texas System (University of Texas System)
• Inventors: Babbs, Daniel A., Xu, Frank Y., Lad, Pankaj B., Stacey, Nicholas A., Truskett, Van N., McMackin, Ian M., Watts, Michael P. C., Voisin, Ronald D., Voth, Duane J.
• Primary Examiner(s): Smith, Duane
• Assistant Examiner(s): Theisen, Douglas J
• Application Number:
  US10/677,639
• Publication Number:
  US 20050072755A1
• Time in Patent Office: 1,048 Days
• Field of Search: 952/46, 952/63, 952/66, 952/45, 952/64, 952/65, 961/93, 962/02, 427/377, 427/378, 427/350, 264/85, 264/102, 430/327, 438/909, 438/935, 425/210, 425/815, 425/DIG.60
• US Class Current: 95/246
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
• CPC Class Codes: Y10S 425/06 Vacuum
• CPC Class Codes: Y10S 425/815 Chemically inert or reactive atmosphere
• CPC Class Codes: Y10S 438/909 Controlled atmosphere

Abstract

The present invention is directed toward a method for reducing pattern distortions in imprinting layers by reducing gas pockets present in a layer of viscous liquid deposited on a substrate. To that end, the method includes varying a transport of the gases disposed proximate to the viscous liquid. Specifically, the atmosphere proximate to the substrate wherein a pattern is to be recorded is saturated with gases that are either highly soluble, highly diffusive, or both with respect to the viscous liquid being deposited. Additionally, or in lieu of saturating the atmosphere, the pressure of the atmosphere may be reduced.

Claims

1. A method for reducing gases present in a layer of viscous liquid deposited on a substrate, said method comprising:

varying a transport of gases proximate to said viscous liquid to increase said transport of said gases in said viscous liquid.

2. The method as recited in claim 1 wherein said transport is selected from a set of transports consisting essentially of a solubility of said gases in said viscous liquid and diffusion of said gases in said viscous liquid.

3. The method as recited in claim 1 further including controlling an atmosphere proximate to said substrate by introducing a fluid, therein, saturated with said viscous liquid.

4. The method as recited in claim 1 further including reducing a pressure of an atmosphere proximate to said substrate.

22. The method as recited in claim 1 wherein varying further includes introducing an atmosphere proximate to said viscous liquid with a helium gas.

23. The method as recited in claim 1 wherein varying further includes saturating an atmosphere proximate to said viscous liquid with a helium gas.

24. The method as recited in claim 1 further including solidifying a pattern into said viscous liquid.

5. A method for reducing gases present in viscous liquid deposited on a substrate, said method comprising:

defining a processing region proximate to said substrate by placing a template in close proximity with said viscous liquid, said processing region having an atmosphere associated therewith; and

varying characteristics of said atmosphere to increase a transport of gases in said atmosphere to said viscous liquid.

6. The method as recited in claim 5 wherein varying further includes increasing a solubility of said atmosphere in said viscous liquid.

7. The method as recited in claim 5 wherein varying further includes increasing diffusion of said atmosphere in said viscous liquid.

8. The method as recited in claim 5 wherein varying further includes introducing, into said atmosphere, a gas selected from a set of gasses consisting of carbon dioxide and helium.

9. The method as recited in claim 8 further including reducing a pressure of said atmosphere.

25. The method as recited in claim 5 further including forming, from said viscous liquid, a solidified patterned layer.

10. A method for reducing gases present in a layer of viscous liquid deposited on a substrate, said method comprising:

placing a template in close proximity with said substrate, defining a processing region therebetween having an atmosphere associated therewith;

introducing a fluid into said atmosphere to increase a transport of said gases in said viscous liquid; and

reducing a pressure of said processing region by applying a vacuum to said processing region.

11. The method as recited in claim 10 wherein introducing further includes increasing a solubility of said atmosphere in said viscous liquid.

12. The method as recited in claim 10 wherein introducing further includes increasing diffusion of said atmosphere in said viscous liquid.

13. The method as recited in claim 10 wherein introducing further includes introducing said fluid into said atmosphere to saturate said atmosphere with said viscous liquid.

14. A method for reducing gases present in a layer of viscous liquid deposited on a substrate, said method comprising:

varying a composition of gases proximate to said viscous liquid to increase transport of said gases in said viscous liquid.

15. The method as recited in claim 14 wherein varying further includes introducing into said gases, defining initial gases, an additional gas having a solubility in said viscous liquid that is greater than a solubility of said initial gases in said viscous liquid.

16. The method as recited in claim 14 wherein varying further includes introducing into said gases, defining initial gases, an additional gas having a diffusivity in said viscous liquid that is greater than a diffusivity of said initial gases in said viscous liquid.

17. The method as recited in claim 14 wherein varying further includes controlling an atmosphere proximate to said substrate by introducing a fluid, therein, saturated with said viscous liquid.

18. The method as recited in claim 14 further including reducing a pressure of an atmosphere proximate to said substrate.

19. The method as recited in claim 15 wherein introducing further includes introducing said additional gas selected from a set of gases consisting of carbon dioxide and helium.

20. The method as recited in claim 16 wherein introducing further includes introducing said additional gas selected from a set of gases consisting of carbon dioxide and helium.

21. The method as recited in claim 14 wherein varying further includes saturating an atmosphere proximate to said viscous liquid with a helium gas.

26. A method for reducing gases present in a viscous liquid deposited on a substrate, said method comprising:

generating a helium-containing atmosphere proximate to said viscous liquid.

27. The method as recited in claim 26 wherein generating further includes varying a composition of gases disposed proximate to said viscous liquid with additional gases including helium.

28. The method as recited in claim 26 wherein generating further includes removing gases proximate to said viscous liquid, defining evacuated gases, and introducing proximate to said viscous liquid helium-containing gases.

29. The method as recited in claim 26 wherein generating further includes removing gases in a processing region proximate to said viscous liquid, defining evacuated gases, and introducing into said processing region helium-containing gases to saturate said processing region with helium gas.

30. The method as recited in claim 26 further including forming, from said viscous liquid, a solidified patterned layer.