Ultra-high capacitance device based on nanostructures
First Claim
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1. A method comprising:
- providing a substrate;
forming a lower insulator over said substrate;
forming a lower conductor over said lower insulator;
forming a diffusion barrier layer to encapsulate said lower conductor;
annealing said lower conductor to form a desired grain size;
forming a conducting nanostructure over said lower conductor, said conducting nanostructure being discontinuous;
arranging said conducting nanostructure over said lower conductor;
orienting a longer dimension of said conducting nanostructure;
forming a thin dielectric over said conducting nanostructure, said thin dielectric being conformal over said conducting nanostructure and said lower conductor;
forming an upper conductor over said thin dielectric; and
forming an upper insulator over said upper conductor.
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Abstract
The present invention discloses a method including providing a substrate; forming a lower conductor over the substrate; forming a conducting nanostructure over the lower conductor; forming a thin dielectric over the conducting nanostructure; and forming an upper conductor over the thin dielectric.
The present invention further discloses a device including a substrate; a lower conductor located over the substrate; a conducting nanostructure located over the lower conductor; a thin dielectric located over the conducting nanostructure; and an upper conductor located over the thin dielectric.
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Citations
6 Claims
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1. A method comprising:
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providing a substrate; forming a lower insulator over said substrate; forming a lower conductor over said lower insulator; forming a diffusion barrier layer to encapsulate said lower conductor; annealing said lower conductor to form a desired grain size; forming a conducting nanostructure over said lower conductor, said conducting nanostructure being discontinuous; arranging said conducting nanostructure over said lower conductor; orienting a longer dimension of said conducting nanostructure; forming a thin dielectric over said conducting nanostructure, said thin dielectric being conformal over said conducting nanostructure and said lower conductor; forming an upper conductor over said thin dielectric; and forming an upper insulator over said upper conductor. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification