Semiconductor thin film, semiconductor device and manufacturing method thereof
First Claim
1. An SRAM comprising:
- a substrate;
an insulating film formed on the substrate, said insulating film having a protrustion;
a pair of cross-coupled driver transistors formed over the substrate;
a pair of access transistors;
a pair of bit lines electrically connected to the cross-coupled driver transistors through the access transistors, respectively; and
a word line electrically connected to the pair of access transistors,wherein at least one of the cross-coupled driver transistors comprises a crystalline semiconductor film formed on the insulating film said crystalline semiconductor film having a mono-domain region in which a channel formation region is formed, andwherein said crystalline semiconductor film comprises a source region and a drain region, and a metallic silicide is formed on the surface of said source region and said drain region.
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Abstract
A semiconductor device includes a substrate having an insulating film on its surface, and ac active layer made of a semiconductive thin film on the substrate surface. The thin film contains a mono-domain region formed of multiple columnar and/or needle-like crystals parallel to the substrate surface without including crystal boundaries therein, allowing the active layer to consist of the mono-domain region only. The insulating film underlying the active layer has a specific surface configuration of an intended pattern in profile, including projections or recesses. To fabricate the active layer, form a silicon oxide film by sputtering on the substrate. Pattern the silicon oxide film providing the surface configuration. Form an amorphous silicon film by low pressure CVD on the silicon oxide film. Retain in the silicon oxide film and/or the amorphous silicon film certain metallic element for acceleration of silicon film to a crystalline silicon film. Then, perform a second heat treatment in the halogen atmosphere forming on the crystalline silicon film a thermal oxide film containing halogen, whereby the crystalline silicon film alters to a mono-domain region.
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Citations
36 Claims
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1. An SRAM comprising:
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a substrate; an insulating film formed on the substrate, said insulating film having a protrustion; a pair of cross-coupled driver transistors formed over the substrate; a pair of access transistors; a pair of bit lines electrically connected to the cross-coupled driver transistors through the access transistors, respectively; and a word line electrically connected to the pair of access transistors, wherein at least one of the cross-coupled driver transistors comprises a crystalline semiconductor film formed on the insulating film said crystalline semiconductor film having a mono-domain region in which a channel formation region is formed, and wherein said crystalline semiconductor film comprises a source region and a drain region, and a metallic silicide is formed on the surface of said source region and said drain region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. The SRAM comprising:
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a substrate; an insulating film formed on the substrate, said insulating film having a protrusion; a pair of cross-coupled driver transistors formed over the substrate; a pair of access transistors; a pair of bit lines electrically connected to the cross-coupled driver transistors through the access transistors, respectively; and a word line electrically connected to the pair of access transistors, wherein at least one of the cross-coupled driver transistors comprises a crystalline semiconductor film formed on the insulating film, said crystalline semiconductor film having a mono-domain region in which a channel formation region is formed, wherein said crystalline semiconductor film comprises a source region and a drain region, and a metallic silicide is formed on the surface of said source region and said drain region, and wherein a crystallization direction of said crystalline semiconductor film is substantially in parallel with a major surface of the substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. An SRAM comprising:
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a substrate; an insulating film formed on the substrate, said insulating film having a protrusion; a pair of cross-coupled driver transistors formed over the substrate; a pair of access transistors; a pair of bit lines electrically connected to the cross-coupled driver transistors through the access transistors, respectively; and a word line electrically connected to the pair of access transistor, wherein at least one of the access transistors comprises a crystalline semiconductor film formed on the insulating film, said crystalline semiconductor film having a mono-domain region in which a channel formation region is formed, wherein said crystalline semiconductor film comprises a source region and a drain region, and a metallic silicide is formed on the surface of said source region and said drain region, and wherein a crystallization direction of said crystalline semiconductor film is substantially in parallel with a major surface of the substrate. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27)
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28. The SRAM comprising:
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a substrate; an insulating film formed on the substrate, said insulating film having a protrusion; a pair of cross-coupled driver transistors formed over the substrate; a pair of access transistors; a pair of bit lines electrically connected to the cross-coupled driver transistors through the access transistors, respectively; and a word line electrically connected to the pair of access transistors, wherein at least one of the cross-coupled driver transistors and the access transistors comprises a crystalline semiconductor film formed on the insulating film, said crystalline semiconductor film having a mono-domain region in which a channel formation region is formed, wherein said crystalline semiconductor film comprises a source region and a drain region, and a metallic silicide is formed on the surface of said source region and said drain region, and wherein a crystallization direction of said crystalline semiconductor film is substantially in parallel with a major surface of the substrate. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36)
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Specification