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Multilayer wiring board and manufacture method thereof

  • US 7,091,589 B2
  • Filed: 12/10/2003
  • Issued: 08/15/2006
  • Est. Priority Date: 12/11/2002
  • Status: Active Grant
First Claim
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1. A multilayer wiring board comprising;

  • a core board; and

    a wiring layer and an electrically insulating layer that are stacked on one surface or both surfaces of said core board, whereina thermal expansion coefficient, in XY directions, of a core member used for said core board falls within a range of 2 to 20 ppm, and said core member is a core member selected from silicon, ceramics, glass, and a glass-epoxy composite,said core board has its front and back that are electrically connected by a plurality of through holes filled with a conductive material,said conductive material protrudes from a surface of said core member at least on one side thereof, andan insulating layer is provided on inner wall surfaces of said through holes of said core member and on the surface of said core member.

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