Multilayer wiring board and manufacture method thereof
First Claim
1. A multilayer wiring board comprising;
- a core board; and
a wiring layer and an electrically insulating layer that are stacked on one surface or both surfaces of said core board, whereina thermal expansion coefficient, in XY directions, of a core member used for said core board falls within a range of 2 to 20 ppm, and said core member is a core member selected from silicon, ceramics, glass, and a glass-epoxy composite,said core board has its front and back that are electrically connected by a plurality of through holes filled with a conductive material,said conductive material protrudes from a surface of said core member at least on one side thereof, andan insulating layer is provided on inner wall surfaces of said through holes of said core member and on the surface of said core member.
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Accused Products
Abstract
In a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on one surface of said core board, a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode being the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer.
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Citations
25 Claims
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1. A multilayer wiring board comprising;
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a core board; and a wiring layer and an electrically insulating layer that are stacked on one surface or both surfaces of said core board, wherein a thermal expansion coefficient, in XY directions, of a core member used for said core board falls within a range of 2 to 20 ppm, and said core member is a core member selected from silicon, ceramics, glass, and a glass-epoxy composite, said core board has its front and back that are electrically connected by a plurality of through holes filled with a conductive material, said conductive material protrudes from a surface of said core member at least on one side thereof, and an insulating layer is provided on inner wall surfaces of said through holes of said core member and on the surface of said core member. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A multilayer wiring board comprising:
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a core board; and a wiring layer and an electrically insulating layer that are stacked on said core board, wherein a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, and a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode being the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer. - View Dependent Claims (9, 10, 11)
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12. A multilayer wiring board comprising:
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a core board; and a wiring layer and an electrically insulating layer that are stacked on said core board, wherein a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, and a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode provided on said core board so as to be connected to the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer. - View Dependent Claims (13, 14, 15)
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16. A multilayer wiring board comprising:
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a core board; and a wiring layer and an electrically insulating layer that are stacked on said core board, wherein a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, and a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode provided on said core board via an electrically insulating layer so as to be connected to the conductive material in said through hole, a dielectric layer provided so as to cover at least part of said upper electrode, and a lower electrode provided so as to cover at least part of said dielectric layer. - View Dependent Claims (17, 18, 19)
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20. A multilayer wiring board comprising:
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a core board; and a wiring layer and an electrically insulating layer that are stacked on said core board, wherein a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, and a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode made of anodizable metal and provided on said core board so as to be connected to the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer made of an oxide of said metal. - View Dependent Claims (21, 22)
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23. A multilayer wiring board comprising:
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a core board; and a wiring layer and an electrically insulating layer that are stacked on said core board, wherein a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, and a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, a conductive substance diffusion preventing layer is provided on inner wall surfaces of said through holes, and a capacitor is provided on one surface of said core board. - View Dependent Claims (24, 25)
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Specification