Multilayer wiring board and manufacture method thereof

• US 7,091,589 B2
• Filed: 12/10/2003
• Issued: 08/15/2006
• Est. Priority Date: 12/11/2002
• Status: Active Grant

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: Akazawa, Miyuki, Mori, Toshiaki, Nakamura, Kazunori, Kuramochi, Satoru, Nakayama, Koichi
• Primary Examiner(s): Owens, Douglas W
• Application Number:
  US10/497,536
• Publication Number:
  US 20050012217A1
• Time in Patent Office: 979 Days
• Field of Search: 257/686, 257/703, 257/678, 257/698, 257/701
• US Class Current: 257/686
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/09563 Metal filled via
• CPC Class Codes: H05K 2201/09581 Applying an insulating coating on the walls of holes
• CPC Class Codes: H05K 2201/09763 Printed component having superposed conductors, but integrated in one circuit layer
• CPC Class Codes: H05K 2201/09827 Tapered, e.g. tapered hole, via or groove
• CPC Class Codes: H05K 2203/025 Abrading, e.g. grinding or sand blasting
• CPC Class Codes: H05K 2203/1338 Chemical vapour deposition
• CPC Class Codes: H05K 2203/1581 Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
• CPC Class Codes: H05K 3/0041 by plasma etching
• CPC Class Codes: H05K 3/0044 Mechanical working of the substrate, e.g. drilling or punching H05K3/0008 takes precedence
• CPC Class Codes: H05K 3/388 : by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: H05K 3/4061 : for via connections in inorganic insulating substrates
• CPC Class Codes: H05K 3/4069 : for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/4076 : by thin-film techniques
• CPC Class Codes: H05K 3/426 : initial plating of through-holes in substrates without metal
• CPC Class Codes: H05K 3/4605 : made from inorganic insulating material
• CPC Class Codes: Y10T 29/43 : Electric condenser making
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49153 : with shaping or forcing terminal into base aperture
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base

Abstract

In a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on one surface of said core board, a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode being the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer.

Claims

1. A multilayer wiring board comprising;

a core board; and

a wiring layer and an electrically insulating layer that are stacked on one surface or both surfaces of said core board, wherein

a thermal expansion coefficient, in XY directions, of a core member used for said core board falls within a range of 2 to 20 ppm, and said core member is a core member selected from silicon, ceramics, glass, and a glass-epoxy composite,

said core board has its front and back that are electrically connected by a plurality of through holes filled with a conductive material,

said conductive material protrudes from a surface of said core member at least on one side thereof, and

an insulating layer is provided on inner wall surfaces of said through holes of said core member and on the surface of said core member.

2. A multilayer wiring board according to claim 1, wherein a thickness of said core member falls within a range of 50 to 500 μ

m, an opening diameter of said through hole on the front side, being a semiconductor chip mounting side, of said core member falls within a range of 10 to 200 μ

m, an opening diameter of said through hole on the back side of said core member falls within a range of 10 to 175 μ

m, the opening diameter on the back side is equal to or less than the opening diameter on the front side, and said conductive material protrudes from the surface of said core member within a range of 5 to 15 μ

m.

3. A multilayer wiring board according to claim 1, wherein said conductive material protrudes from the surface of said core member within a range of 5 to 15 μ

m to form a land, and a diameter of said land is larger than an opening diameter of said through hole filled with said conductive material.

4. A multilayer wiring board according to claim 3, wherein peripheral portions around said protruding lands are covered with an electrically insulating layer so that a flat surface is formed.

5. A multilayer wiring board according to claim 1, wherein an opening diameter of said through hole of said core member falls within a range of 10 to 100 μ

m, and a conductive substance diffusion preventing layer is provided on inner wall surfaces of said through holes.

6. A multilayer wiring board according to claim 5, wherein said conductive substance diffusion preventing layer is a thin film of titanium nitride.

7. A multilayer wiring board according to claim 5, wherein an opening diameter of said through hole of said core member falls within a range of 10 to 30 μ

m.

8. A multilayer wiring board comprising:

a core board; and

a wiring layer and an electrically insulating layer that are stacked on said core board, wherein

a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, and a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal,

said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and

a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode being the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer.

9. A multilayer wiring board according to claim 8, wherein a material of a dielectric layer forming said capacitor is one selected from silicon oxide, silicon nitride, barium strontium titanate, tantalum pentoxide, lead zirconate titanate, strontium titanate, aluminum oxide, benzocyclobutene resin, cardo resin, and polyimide resin.

10. A multilayer wiring board according to claim 8, wherein a material of said wiring layer and said lower electrode is selected from the group consisting of one kind of metal among Al, Cr, Cu, Ti, Pt, Ru, Ta, and W, and an oxide, a nitride, or an alloy of said metal, and a multilayer film in optional combination of said metal, said oxide, said nitride, said alloy, and polysilicon.

11. A multilayer wiring board according to claim 8, wherein a thickness of said core board falls within a range of 50 to 300 μ

m, and an opening diameter of said through hole falls within a range of 10 to 300 μ

m.

12. A multilayer wiring board comprising:

a core board; and

a wiring layer and an electrically insulating layer that are stacked on said core board, wherein

a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, and a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal,

said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and

a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode provided on said core board so as to be connected to the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer.

13. A multilayer wiring board according to claim 12, wherein a material of a dielectric layer forming said capacitor is one selected from silicon oxide, silicon nitride, barium strontium titanate, tantalum pentoxide, lead zirconate titanate, strontium titanate, aluminum oxide, benzocyclobutene resin, cardo resin, and polyimide resin.

14. A multilayer wiring board according to claim 12, wherein a material of said wiring layer and said lower electrode is selected from the group consisting of one kind of metal among Al, Cr, Cu, Ti, Pt, Ru, Ta, and W, and an oxide, a nitride, or an alloy of said metal, and a multilayer film in optional combination of said metal, said oxide, said nitride, said alloy, and polysilicon.

15. A multilayer wiring board according to claim 12, wherein a thickness of said core board falls within a range of 50 to 300 μ

m, and an opening diameter of said through hole falls within a range of 10 to 300 μ

m.

16. A multilayer wiring board comprising:

a core board; and

a wiring layer and an electrically insulating layer that are stacked on said core board, wherein

a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, and a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal,

said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and

a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode provided on said core board via an electrically insulating layer so as to be connected to the conductive material in said through hole, a dielectric layer provided so as to cover at least part of said upper electrode, and a lower electrode provided so as to cover at least part of said dielectric layer.

17. A multilayer wiring board according to claim 16, wherein a material of a dielectric layer forming said capacitor is one selected from silicon oxide, silicon nitride, barium strontium titanate, tantalum pentoxide, lead zirconate titanate, strontium titanate, aluminum oxide, benzocyclobutene resin, cardo resin, and polyimide resin.

18. A multilayer wiring board according to claim 16, wherein a material of said wiring layer and said lower electrode is selected from the group consisting of one kind of metal among Al, Cr, Cu, Ti, Pt, Ru, Ta, and W, and an oxide, a nitride, or an alloy of said metal, and a multilayer film in optional combination of said metal, said oxide, said nitride, said alloy, and polysilicon.

19. A multilayer wiring board according to claim 16, wherein a thickness of said core board falls within a range of 50 to 300 μ

m, and an opening diameter of said through hole falls within a range of 10 to 300 μ

m.

20. A multilayer wiring board comprising:

a core board; and

a wiring layer and an electrically insulating layer that are stacked on said core board, wherein

a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, and a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal,

said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and

a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode made of anodizable metal and provided on said core board so as to be connected to the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer made of an oxide of said metal.

21. A multilayer wiring board according to claim 20, wherein a material of said wiring layer and said lower electrode is selected from the group consisting of one kind of metal among Al, Cr, Cu, Ti, Pt, Ru, Ta, and W, and an oxide, a nitride, or an alloy of said metal, and a multilayer film in optional combination of said metal, said oxide, said nitride, said alloy, and polysilicon.

22. A multilayer wiring board according to claim 20, wherein a thickness of said core board falls within a range of 50 to 300 μ

m, and an opening diameter of said through hole falls within a range of 10 to 300 μ

m.

23. A multilayer wiring board comprising:

a core board; and

a wiring layer and an electrically insulating layer that are stacked on said core board, wherein

a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, and a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal,

said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material,

a conductive substance diffusion preventing layer is provided on inner wall surfaces of said through holes, and

a capacitor is provided on one surface of said core board.

24. A multilayer wiring board according to claim 23, wherein said conductive substance diffusion preventing layer is a thin film of titanium nitride.

25. A multilayer wiring board according to claim 23, wherein an opening diameter of said through hole of said core member falls within a range of 10 to 30 μ

m.