Transformer implementation using bonding wires
First Claim
1. A transformer for transforming a differential signal to a single-ended signal, the transformer comprising:
- a first pair of bonding wires, wherein a first bonding wire of the first pair is connected to the single-ended signal and a second bonding wire of the first pair is coupled to a reference voltage; and
a second pair of bonding wires carrying a differential current associated with the differential signal, wherein a third bonding wire of the second pair is magnetically coupled to the first bonding wire, a fourth bonding wire of the second pair is magnetically coupled to the second bonding wire, the first and second bonding wires are electrically coupled, and each of the first, second, third, and fourth bonding wires is a single bonding wire partially disposed over silicon.
3 Assignments
0 Petitions
Accused Products
Abstract
The use of the magnetic coupling between bonding wires can be advantageously used to transform a differential signal to a single-ended signal. Because bonding wires are very good conductors, this differential to single-ended signal transformation can be performed with minimal signal loss. Moreover, because bonding wires are already part of an integrated circuit package, both system cost and board resources are minimized. The magnetic coupling between bonding wires can also be used to combine the power of a plurality of amplifiers. This magnetic coupling can also be used to provide a single-ended to differential signal transformation.
41 Citations
16 Claims
-
1. A transformer for transforming a differential signal to a single-ended signal, the transformer comprising:
-
a first pair of bonding wires, wherein a first bonding wire of the first pair is connected to the single-ended signal and a second bonding wire of the first pair is coupled to a reference voltage; and a second pair of bonding wires carrying a differential current associated with the differential signal, wherein a third bonding wire of the second pair is magnetically coupled to the first bonding wire, a fourth bonding wire of the second pair is magnetically coupled to the second bonding wire, the first and second bonding wires are electrically coupled, and each of the first, second, third, and fourth bonding wires is a single bonding wire partially disposed over silicon. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. An amplifier output stage for transforming a differential signal to a single-ended signal, the amplifier output stage comprising:
-
a first transistor controlled by a negative component of an input differential signal; a second transistor controlled by a positive component of the input differential signal; a first pair of bonding wires, wherein a first bonding wire of the first pair is coupled between a first voltage source and the first transistor, and wherein a second bonding wire of the first pair is coupled between the first voltage source and the second transistor; and a second pair of bonding wires, wherein a third bonding wire is coupled to the single-ended signal and a fourth bonding wire is coupled to a reference voltage, the third and fourth bonding wires are electrically coupled, the first and third bonding wires are magnetically coupled, the second and fourth bonding wires are magnetically coupled, and the first, second, third, and fourth bonding wires are individual bonding wires partially disposed over silicon. - View Dependent Claims (8, 9)
-
-
10. An amplifier input stage for transforming a single-ended signal to a differential signal, the amplifier input stage comprising:
-
a first input terminal to the amplifier receiving a negative component of the differential signal; a second input terminal to the amplifier receiving a positive component of the differential signal; a first pair of bonding wires, wherein a first bonding wire of the first pair is coupled between a first voltage source and the first input terminal, a second bonding wire of the first pair is coupled between the first voltage source and the second input terminal, and the first and second bonding wires are individual bonding wires partially disposed over silicon; and a second pair of bonding wires, wherein a third bonding wire is coupled to the single-ended signal and a fourth bonding wire is coupled to a reference voltage, the third and fourth bonding wires are individual bonding wires partially disposed over silicon, the third and fourth bonding wires are electrically coupled, the first and third bonding wires are magnetically coupled, and the second and fourth bonding wires are magnetically coupled. - View Dependent Claims (11, 12)
-
-
13. A bonding configuration for an output stage of an amplifier, the output stage comprising:
-
a first transistor controlled by a negative component of an input differential signal; a second transistor controlled by a positive component of the input differential signal; a first pair of bonding wires, wherein a first bonding wire of the first pair is coupled between a first voltage source and the first transistor, and wherein a second bonding wire of the first pair is coupled between the first voltage source and the second transistor; and a second pair of bonding wires, wherein a third bonding wire of the second pair is magnetically coupled to the first bonding wire, wherein a fourth bonding wire of the second pair is magnetically coupled to the second bonding wire, and wherein the third and fourth bonding wires are electrically connected; the bonding configuration including; a first bonding pad for coupling the first transistor and the first bonding wire; a second bonding pad for coupling the second transistor and the second bonding wire; a first pin for coupling the first and second bonding wires; a second pin for coupling the third bonding wire to an output of the output stage; a third pin for coupling the fourth bonding wire to a reference voltage; a third bonding pad for connecting to the third bonding wire; a fourth bonding pad for connecting to the fourth bonding wire, wherein the third and fourth bonding pads are coupled using a connector.
-
-
14. A bonding configuration for an input stage of an amplifier, the input stage comprising:
-
a first input terminal of the amplifier receiving a negative component of a differential signal; a second input terminal of the amplifier receiving a positive component of the differential signal; a first pair of bonding wires, wherein a first bonding wire of the first pair is coupled between a first voltage source and the first input terminal, and wherein a second bonding wire of the first pair is coupled between the first voltage source and the second input terminal; and a second pair of bonding wires, wherein a third bonding wire of the second pair is magnetically coupled to the first bonding wire, wherein a fourth bonding wire of the second pair is magnetically coupled to the second bonding wire, and wherein the third and fourth bonding wires are electrically connected; the bonding configuration including; a first bonding pad for coupling the first input terminal and the first bonding wire; a second bonding pad for coupling the second input terminal and the second bonding wire; a first pin for coupling the first and second bonding wires; a second pin for coupling the third bonding wire to an input of the input stage; a third pin for coupling the fourth bonding wire to a reference voltage; a third bonding pad for connecting to the third bonding wire; a fourth bonding pad for connecting to the fourth bonding wire, wherein the third and fourth bonding pads are coupled using a connector.
-
-
15. A method of combining power of a plurality of amplifiers to a single-ended power output, the method comprising:
-
using bonding wire pairs to provide the single-ended power output, wherein each amplifier comprises an output stage including; a first transistor connected to a first voltage source and controlled by a negative component of an input differential signal; a second transistor connected to the first voltage source and controlled by a positive component of the input differential signal; a first pair of bonding wires electrically coupled to a second voltage source and to the first and second transistors; and a second pair of bonding wires magnetically coupled to the first pair of bonding wires, wherein the second pairs of bonding wires are electrically coupled in series between a first output providing the single-ended power output and a second output coupled to a reference voltage.
-
-
16. A bonding configuration for a plurality of amplifiers coupled to provide a single-ended power output, each amplifier comprising:
-
an output stage including; a first transistor controlled by a negative component of an input differential signal; a second transistor controlled by a positive component of the input differential signal; a first pair of bonding wires electrically coupled to a first voltage source and to the first and second transistors; and a second pair of bonding wires magnetically coupled to the first pair of bonding wires, wherein the second pairs of bonding wires for the plurality of amplifiers are electrically coupled in series between the single-ended power output and a reference voltage; the bonding configuration for each output stage including; a first pair of bonding pads for coupling to first pair of bonding wires; a first pin for coupling the first pair of bonding wires to the first voltage source; a second pair of bonding pads for electrically coupling the second pair of bonding wires; and a pin pair for coupling to the second pair of bonding wires, wherein each pin of the pin pair is one of shared by an adjacent output stage, coupled to the single-ended power output, and coupled to the reference voltage.
-
Specification