Integrated circuit transformer for radio frequency applications

• US 7,091,813 B2
• Filed: 06/13/2002
• Issued: 08/15/2006
• Est. Priority Date: 06/13/2002
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Liang, Tao, Wang, Xiaodong
• Primary Examiner(s): Nguyen, Tuyen T.
• Application Number:
  US10/167,484
• Publication Number:
  US 20030231095A1
• Time in Patent Office: 1,524 Days
• Field of Search: 336/65, 336/83, 336/192, 336/200, 336206-208, 336/232
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/0093 Common mode choke coil
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

An integrated circuit transformer. A substrate supporting multiple layers of materials of an integrated circuit is provided with a first metallization layer comprising a first set of turns of a primary winding of a transformer, and a second set of turns of a secondary winding of the transformer. A insulation layer is deposited over the first metallization layer, and a second metallization layer bearing a second set of turns of the primary winding, and an optional third set of turns of a second secondary winding. A via connection connects one end of the first set of turns of the primary winding to the second turns of the primary winding located on the second metallization layer. The result is a transformer structure where the primary winding is provided on multiple layers and each secondary winding is confined to a single layer.

Claims

1. An integrated circuit transformer comprising:

a substrate for supporting multiple layers of an integrated circuit;

a first metallization layer comprising a first set of turns of a primary winding of a transformer, and separated by a second set of turns of a first secondary winding of said transformer confined to said first metallization layer, each turn of said first secondary winding being separated by a winding of said first set of turns of said primary winding;

a second metallization layer separated from said first metallization layer by an insulating layer, said second metallization layer comprising a second set of turns of said primary windings separated by turns of a second secondary winding confined to said second metallization layer; and

a via connection connecting one end of said primary first set of turns to one end of said primary winding second turns, whereby a complete primary winding is provided using said first and second metallization layers, and said secondary windings are confined to said first and second metallization layers respectively.

2. The integrated circuit transformer according to claim 1 comprising a third metallization layer for connecting the ends of said windings to external connections of said integrated circuit.

3. The integrated circuit transformer according to claim 1 further comprising a set of turns forming a second secondary winding coplanar with, and separated by, said second set of turns of said primary winding and confined to said second metallization layer.