Thermal management system and method for electronic equipment mounted on coldplates

• US 7,092,255 B2
• Filed: 12/13/2005
• Issued: 08/15/2006
• Est. Priority Date: 05/18/2004
• Status: Active Grant

• Current Assignee: OL Security LLC (Intellectual Ventures LLC)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Weber, Richard M., Haws, James L., Barson, George F.
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US11/301,567
• Publication Number:
  US 20060098410A1
• Time in Patent Office: 245 Days
• Field of Search: 361/689, 361/698, 361/699, 361/704, 361/709, 361/711, 165/80.3, 165/80.4, 165/104.33, 257712-714, 174/15.1
• US Class Current: 361/699
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 2201/064 Fluid cooling, e.g. by integral pipes
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant

Abstract

According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate, and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface. The highly conductive material is operable to transfer heat from the mounting surface to the fluid flow.

Claims

1. A thermal management system for electronic components, comprising:

a highly conductive housing having a mounting surface for mounting one or more electronic components;

a plastic coldplate disposed within the highly conductive housing; and

a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface, the highly conductive material operable to spread the heat throughout a volume of the plastic coldplate.

2. The system of claim 1, wherein the electronic components comprise an Active Electronically Scanned Array.

3. The system of claim 1, further comprising a circuit board for mounting the one or more electronic components, the circuit board coupled to the mounting surface.

4. The system of claim 1, wherein the highly conductive material comprises a plurality of vertical fins, the vertical fins coupled to a plurality of heat pipes.

5. The system of claim 1, wherein the highly conductive material comprises a plurality of vertical posts coupled to the mounting surface.

6. The system of claim 5, wherein the vertical posts are further coupled to a surface of the coldplate opposite the mounting surface.

7. The system of claim 1, wherein the highly conductive material comprises a plurality of vertical posts coupled to a plurality of horizontal fins.

8. The system of claim 7, wherein the vertical posts couple to both the mounting surface and a surface of the coldplate opposite the mounting surface.

9. A thermal management method for electronic components, comprising:

mounting one or more electronic components on a mounting surface of a highly conductive housing;

disposing a plastic coldplate within the highly conductive housing;

disposing a highly conductive material within the plastic coldplate; and

thermally coupling the highly conductive material to the mounting surface to spread the heat throughout a volume of the plastic coldplate.

10. The method of claim 9, wherein the electronic components comprise an Active Electronically Scanned Array.

11. The method of claim 9, wherein mounting the one or more electronic components on the mounting surface of the highly conductive housing comprises mounting the one or more electronic components on a circuit board and mounting the circuit board to the mounting surface.

12. The method of claim 9, wherein thermally coupling the highly conductive material to the mounting surface comprises coupling a plurality of vertical fins to the highly conductive housing and coupling the vertical fins to a plurality of heat pipes.

13. The method of claim 9, wherein thermally coupling the highly conductive material to the mounting surface comprises coupling a plurality of vertical posts to the mounting surface.

14. The method of claim 9, wherein thermally coupling the highly conductive material to the mounting surface comprises coupling a plurality of vertical posts to the highly conductive housing and coupling a plurality of horizontal fins to the vertical posts.