Direct conversion energy discriminating CT detector

• US 7,092,481 B2
• Filed: 05/19/2004
• Issued: 08/15/2006
• Est. Priority Date: 05/19/2004
• Status: Active Grant

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Hoffman, David M.
• Primary Examiner(s): Church, Craig E
• Assistant Examiner(s): Yun, Jurie
• Application Number:
  US10/848,877
• Publication Number:
  US 20050259783A1
• Time in Patent Office: 818 Days
• Field of Search: 378/19, 378/98.8, 250/370.09, 250/370.13, 250/370.06
• US Class Current: 378/19
• CPC Class Codes: A61B 6/032 Transmission computed tomography [CT]
• CPC Class Codes: A61B 6/4241 using energy resolving detectors, e.g. photon counting
• CPC Class Codes: A61B 6/4411 the apparatus being modular A61B6/4283 takes precedence
• CPC Class Codes: G01N 2223/419 computed tomograph
• CPC Class Codes: G01N 2223/612 biological material
• CPC Class Codes: G01N 23/046 using tomography, e.g. computed tomography [CT]
• CPC Class Codes: G01T 1/2985 In depth localisation, e.g. using positron emitters; Tomographic imaging (longitudinal and transverse section imaging; apparatus for radiation diagnosis sequentially in different planes, steroscopic radiation diagnosis); using external radiation sources A61B6/02

Abstract

A CT detector capable of energy discrimination and direct conversion is disclosed. The detector includes multiple layers of semiconductor material with the layers having varying thicknesses. The detector is constructed to be segmented in the x-ray penetration direction so as to optimize count rate performance as well as avoid saturation.

Claims

1. A direct conversion CT detector comprising:

multiple direct conversion layers designed to directly convert radiographic energy to electrical signals representative of energy sensitive CT data; and

an electrical signal collection layer sandwiched between adjacent direct conversion layers.

2. The detector of claim 1 further comprising a voltage application layer positioned adjacent to a surface of each direct conversion layer opposite to that which the electrical signal collection layer is positioned.

3. The detector of claim 2 wherein each direct conversion layer is in contact with an electrical signal collection layer and a voltage application layer.

4. The detector of claim 1 wherein each direct conversion layer is formed of semiconductor material.

5. The detector of claim 4 wherein the semiconductor material includes CZT.

6. The detector of claim 1 wherein the multiple direct conversion layers are arranged in a stack in an x-ray penetration direction.

7. The detector of claim 6 wherein the multiple direct conversion layers are formed of a material such that a direct conversion layer closer to an x-ray source has more x-rays deposited therein than a direct conversion layer farther from the x-ray source.

8. The detector of claim 1 wherein each direct conversion layer has a uniform thickness.

9. The detector of claim 1 wherein a first direct conversion layer has a thickness different than that of a second direct conversion layer.

10. The detector of claim 9 wherein thickness of the direct conversion layers increases with distance from an x-ray source.

11. The detector of claim 1 wherein the energy sensitive data includes material composition and atomical density data.

12. The detector of claim 1 wherein the electrical signal collection layer is thinner than each direct conversion layer.

13. The detector of claim 1 wherein the electrical signal collection layer is configured to receive electrical signals from at least a pair of direct conversion layers.

14. A CT system comprising:

a rotatable gantry having a bore centrally disposed therein;

a table movable fore and aft through the bore and configured to position a subject for CT data acquisition;

a radiographic energy projection source positioned within the rotatable gantry and configured to project radiographic energy toward the subject; and

a detector array disposed within the rotatable gantry and configured to detect radiographic energy projected by the projection source and impinged by the subject, the detector array including a plurality of detector cells, each cell comprising stacked arrangement of semiconductor layers in a direction generally that of energy projection and designed to provide energy sensitive data acquired from the subject in response to receiving radiographic energy, wherein the stacked arrangement includes an electrode film sandwiched between adjacent semiconductor layers.

15. The CT system of claim 14 wherein the electrode film between adjacent semiconductor layers is designed to either apply a voltage to or receive electrical signals from adjacent semiconductor layers.

16. The CT system of claim 14 wherein each semiconductor layer is connected to a voltage-applying electrode and a signal collection electrode.

17. The CT system of claim 14 wherein the semiconductor layers of a single cell vary in thickness as a function of distance from the radiographic energy source.

18. The CT system of claim 16 wherein a semiconductor layer closer to the radiographic energy source is configured to absorb more radiographic energy than a semiconductor farther away from the radiographic energy source.

19. A CT detector comprising:

a first means and a second means for directly converting radiographic energy to electrical signals; and

means for receiving electrical signals interstitially positioned between the first means for directly converting and the second means for directly converting.

20. The CT detector of claim 19 further comprising means for applying a voltage to the first means and the second means for directly converting.

21. The CT detector of claim 19 wherein the means for applying a voltage includes a first means to applying a voltage to the first means for directly converting and a second means to applying a voltage to the second means for directly converting.