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Method for manufacturing thin GaAs die with copper-back metal structures

  • US 7,092,890 B2
  • Filed: 02/03/2005
  • Issued: 08/15/2006
  • Est. Priority Date: 11/27/2002
  • Status: Expired due to Term
First Claim
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1. A method comprising:

  • placing a GaAs die having a thickness of less than approximately 50 microns on a lead frame having a die attach surface comprising a soft solder; and

    heating the soft solder to attach the die to the lead frame.

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