Method for manufacturing thin GaAs die with copper-back metal structures
First Claim
Patent Images
1. A method comprising:
- placing a GaAs die having a thickness of less than approximately 50 microns on a lead frame having a die attach surface comprising a soft solder; and
heating the soft solder to attach the die to the lead frame.
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Abstract
A thin GaAs Substrate can be provided with a copper back-metal layer to allow the GaAs Substrate to be packaged using conventional plastic packaging technologies. By providing the GaAs Substrate with a copper back-metal layer, the GaAs Substrate can be made thinner than 2 mils (about 50 microns), thereby reducing heat dissipation problems and allowing the semiconductor die to be compatible with soft-solder technologies. By enabling the semiconductor die to be packaged in a plastic package substantial cost savings can be achieved.
22 Citations
20 Claims
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1. A method comprising:
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placing a GaAs die having a thickness of less than approximately 50 microns on a lead frame having a die attach surface comprising a soft solder; and heating the soft solder to attach the die to the lead frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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forming a diffusion barrier layer overlying a backside surface of a GaAs substrate; forming a stress relief layer overlying the diffusion barrier layer; forming a copper back-metal layer overlying the stress relief layer; and forming an oxidation resistant layer overlying the copper-back metal layer. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A method comprising:
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forming a semiconductor die comprising a GaAs substrate and a copper back-metal layer overlying a backside surface of the GaAs substrate; disposing the semiconductor die at a soft solder layer of a die attach surface of a lead frame; reflowing the soft-solder layer so as to form a solder joint between the die attach surface and the semiconductor die; electrically coupling the semiconductor die to one or more leads of the lead frame; and encapsulating the semiconductor die and the lead frame in a plastic die package. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification