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Apparatus for deforming resilient contact structures on semiconductor components

  • US 7,093,622 B2
  • Filed: 07/16/2004
  • Issued: 08/22/2006
  • Est. Priority Date: 08/28/2000
  • Status: Expired due to Term
First Claim
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1. A method for planarizing resilient contact structures on a semiconductor component comprising:

  • providing a deformation apparatus configured to physically engage the resilient contact structures;

    physically engaging the resilient contact structures using the deformation apparatus; and

    following the physically engaging step, moving the deformation apparatus or the component, or both the deformation apparatus and the component, in X, Y and Z directions to bend, compress or shape the resilient contact structures.

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