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Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape

  • US 7,094,618 B2
  • Filed: 02/13/2004
  • Issued: 08/22/2006
  • Est. Priority Date: 08/25/2000
  • Status: Expired due to Fees
First Claim
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1. A method of marking a packaged semiconductor device comprising:

  • providing a semiconductor die having a reduced cross-section in wafer form;

    packaging the semiconductor die forming a packaged semiconductor device, the packaged semiconductor device having a surface;

    applying a tape having optical energy-markable properties to at least a portion of the surface of the packaged semiconductor device;

    subsequently exposing at least a portion of the tape to optical energy; and

    forming a mark.

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