×

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

  • US 7,094,629 B2
  • Filed: 10/01/2004
  • Issued: 08/22/2006
  • Est. Priority Date: 03/27/1998
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method of manufacturing a substrate, comprising:

  • providing a substrate;

    forming a penetrating hole in the substrate so that an internal wall of the penetrating hole of the substrate has a protrusion; and

    forming a wiring pattern above the substrate, the wiring pattern formed over the penetrating hole.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×