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Semiconductor device, semiconductor package member, and semiconductor device manufacturing method

  • US 7,095,112 B2
  • Filed: 09/17/2003
  • Issued: 08/22/2006
  • Est. Priority Date: 09/19/2002
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device, comprising:

  • a wiring board;

    a semiconductor chip provided on said wiring board and having a pad electrically connected to a wiring on said wiring board; and

    a second semiconductor chip, provided on said wiring board, having a semiconductor substrate with a side facing a side of said semiconductor chip, having a plurality of passive elements integrated on said semiconductor substrate, and having a plurality of pads for external connection to which both ends of each of said plurality of passive elements are electrically connected respectively, at least one of said both ends of at least one of said plurality of passive elements is electrically connected via at least one of said plurality of pads for external connection to said wiring on said wiring board electrically connected to said pad of said semiconductor chip.

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