Sensor semiconductor package, provided with an insert, and method for making same

• US 7,095,123 B2
• Filed: 01/10/2002
• Issued: 08/22/2006
• Est. Priority Date: 01/15/2001
• Status: Active Grant

• Current Assignee: STMicroelectronics SA (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SA (STMicroelectronics NV)
• Inventors: Prior, Christophe
• Primary Examiner(s): Geyer, Scott B.
• Application Number:
  US10/466,191
• Publication Number:
  US 20040077118A1
• Time in Patent Office: 1,685 Days
• Field of Search: 257/678, 257/680, 257/690, 257/734, 257/787
• US Class Current: 257/787
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

A semiconductor package includes a mounting and electrical connection plate, and a semiconductor component having front and rear surfaces and including a sensor. The rear surface of the semiconductor component is attached to the mounting and electrical connection plate and the front surface is attached to the sensor. An insert is adjacent the front face of the semiconductor component and the sensor and has an access passage for exposing the sensor. A plug is in the access passage of the insert. A body of encapsulation material surrounds the mounting and electrical connection plate, the semiconductor component and the insert.

Claims

1. A semiconductor package comprising:

a lead frame;

a semiconductor component having front and rear surfaces and comprising a sensor, the rear surface being attached to said lead frame and the front surface being attached to said sensor;

an insert adjacent the front face of said semiconductor component and said sensor, said insert having an access passage for exposing said sensor;

a plug positioned within a portion of the access passage of said insert; and

a body of encapsulation material surrounding said lead frame, said semiconductor component and said insert.

2. A semiconductor package according to claim 1, further comprising a seal for attaching said insert to the front face of said semiconductor component, said seal forming a spacer therebetween.

3. A semiconductor package according to claim 1, further comprising a layer of adhesive for attaching said insert to the front face of said semiconductor component.

4. A semiconductor package according to claim 1, wherein said plug is transparent.

5. A semiconductor package according to claim 1, wherein said insert has a slot in an outer surface thereof.

6. A semiconductor package according to claim 1, wherein said lead frame comprises:

a platform for mounting said semiconductor component; and

at least one electrical connection lead extending outwardly from said body of encapsulating material.

7. A semiconductor package according to claim 1, wherein said lead frame comprise a mounting and electrical connection plate.

8. A semiconductor package according to claim 7, wherein said body of encapsulating material extends at least in front of said plate.

9. A semiconductor package comprising:

a mounting plate;

a semiconductor component having front and rear surfaces and comprising a sensor, the rear surface attached to said mounting plate and the front surface attached to said sensor;

an insert spaced apart from the front face of said semiconductor component and said sensor, said insert having an access passage for exposing said sensor;

a plug positioned within a portion of the access passage of said insert;

a seal for attaching said insert to the front face of said semiconductor component and forming a spacer therebetween; and

a body of encapsulation material surrounding said mounting plate, said semiconductor component and said insert.

10. A semiconductor package according to claim 9, wherein said plug is transparent.

11. A semiconductor package according to claim 9, wherein said insert has a slot in an outer surface thereof.

12. A semiconductor package according to claim 9, wherein said mounting plate comprises:

a platform for mounting said semiconductor component; and

at least one electrical connection lead extending outwardly from said body of encapsulating material.

13. A semiconductor package comprising:

a mounting plate;

a semiconductor component having front and rear surfaces and comprising a sensor, the rear surface being attached to said mounting plate and the front surface being attached to said sensor;

an insert attached to the front face of said semiconductor component, said insert having an access passage for exposing said sensor;

a plug positioned within a portion of the access passage of said insert; and

a body of encapsulation material surrounding said mounting plate, said semiconductor component and said insert.

14. A semiconductor package according to claim 13, wherein said plug is transparent.

15. A semiconductor package according to claim 13, wherein said insert has a slot in an outer surface thereof.

16. A semiconductor package according to claim 13, wherein said mounting plate comprises:

a platform for mounting said semiconductor component; and

at least one electrical connection lead extending outwardly from said body of encapsulating material.

17. A semiconductor package according to claim 16, wherein said body of encapsulating material extends at least in front of said platform.

18. A semiconductor package according to claim 13, wherein said mounting plate comprises a mounting and electrical connection plate.