Integrated circuit package including miniature antenna
First Claim
1. An integrated circuit package comprising:
- at least one substrate, each substrate including at least one layer;
at least one semiconductor die;
at least one terminal;
an antenna located in said integrated circuit package but not on said at least one semiconductor die, said antenna comprising a conducting pattern, at least a portion of which includes a curve, wherein said curve comprises at least five segments, each of said at least five segments forming a pair of angles with each adjacent segment in said curve, at least three of said segments being shorter than one-tenth of the longest free-space operating wavelength of said antenna;
wherein the smaller angle of the pair of angles between adjacent segments is less than 180° and
at least two of said smaller angles between adjacent segments are less than 115°
, wherein at least two of smaller said angles are not equal; and
wherein said conducting pattern fits inside a rectangular area, the longest side of said rectangular area being shorter than one-fifth of the longest free-space operating wavelength of said antenna.
1 Assignment
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Accused Products
Abstract
The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor die. The conducting pattern comprises a curve having at least five sections or segments, at least three of the sections or segments being shorter than one-tenth of the longest free-space operating wavelength of the antenna, each of the five sections or segments forming a pair of angles with each adjacent segment or section, wherein the smaller angle of each of the four pairs of angles between sections or segments is less than 180° (i.e., no pair of sections or segments define a longer straight segment), wherein at least two of the angles are less than 115°, wherein at least two of the angles are not equal, and wherein the curve fits inside a rectangular area the longest edge of which is shorter than one-fifth of the longest free-space operating wavelength of the antenna.
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Citations
60 Claims
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1. An integrated circuit package comprising:
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at least one substrate, each substrate including at least one layer; at least one semiconductor die; at least one terminal; an antenna located in said integrated circuit package but not on said at least one semiconductor die, said antenna comprising a conducting pattern, at least a portion of which includes a curve, wherein said curve comprises at least five segments, each of said at least five segments forming a pair of angles with each adjacent segment in said curve, at least three of said segments being shorter than one-tenth of the longest free-space operating wavelength of said antenna; wherein the smaller angle of the pair of angles between adjacent segments is less than 180° and
at least two of said smaller angles between adjacent segments are less than 115°
, wherein at least two of smaller said angles are not equal; andwherein said conducting pattern fits inside a rectangular area, the longest side of said rectangular area being shorter than one-fifth of the longest free-space operating wavelength of said antenna. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60)
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Specification