Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus

• US 7,095,623 B2
• Filed: 05/27/2003
• Issued: 08/22/2006
• Est. Priority Date: 05/27/2002
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Akahoshi, Haruo, Suwa, Tokihito, Kumamoto, Shingo
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): Semenenko, Yuriy
• Application Number:
  US10/445,000
• Publication Number:
  US 20030218871A1
• Time in Patent Office: 1,183 Days
• Field of Search: 174/268, 174/257, 174/261, 174/262, 174/265, 174/266, 174/255, 428/209, 428/901, 361/795
• US Class Current: 361/795
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/0338 Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer etched tri-metal structure H05K2201/0361
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein reduction of cross-talk, noise or interference by patterned shielding planes, ground planes or power planes H05K1/0224
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09554 Via connected to metal substrate
• CPC Class Codes: H05K 2201/09627 Special connections between adjacent vias, not for grounding vias redundant conductors or connections H05K2201/0979
• CPC Class Codes: H05K 2201/09663 Divided layout, i.e. conductors divided in two or more parts branched layout H05K2201/09254
• CPC Class Codes: H05K 3/44 Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits H05K3/0058, H05K3/4608, and H05K3/4641 take precedence
• CPC Class Codes: H05K 3/4641 having integrally laminated metal sheets or special power cores

Abstract

A multilayer circuit board having a high level of reliability in terms of electric connection against temperature changes caused by the actual operation of electronic equipment, a manufacturing process, a substrate for multilayer circuitry, and an electronic apparatus. The multilayer circuit board comprises a laminate of at least one insulating layer and at least one wiring layer, wherein the wiring layer is formed by a composite member comprising a first metal layer and a second metal layer formed on one or both sides of the first metal layer, the first metal layer having a smaller coefficient of thermal expansion than the second metal layer, the second metal layer having a higher electric conductivity than the first metal layer, wherein the insulating layer has a blind via-hole with a bottom provided by a surface of the second metal layer, the circuit board further comprising a layer-to-layer interconnection portion on the surface of the insulating layer and in the blind via-hole, wherein the layer-to-layer interconnection portion in the blind via-hole is formed in such a manner as to be in contact with the surface of the second metal layer.

Claims

1. A multilayer circuit board comprising a laminate of at least one insulating layer and a plurality of wiring layers separated from one another by the insulating layer, wherein at least one of the wiring layers is formed by a composite material including a first metal layer and a second metal layer formed on one or both sides of the first metal layer, the first metal layer having a smaller coefficient of thermal expansion than the second metal layer, the second metal layer having a higher electric conductivity than the first metal layer, wherein the insulating layer in contact with the second metal layer has a blind via-hole whose bottom portion is formed by a surface of the second metal layer, and the composite material and the wiring layers are in a layer-to-layer interconnection with one another through a layer-to-layer interconnection portion which is in contact with the second metal layer formed in the blind via-hole.

2. The multilayer circuit board according to claim 1, wherein the wiring layer formed on the surface of the insulating layer is a plated metal layer or a sequentially formed layered structure, which consists of a metal foil and a plated metal layer on it.

3. The multilayer circuit board according to claim 1, wherein the first metal layer or the iron-nickel alloy layer comprises an alloy whose average thermal expansion coefficient at temperatures from 30 to 200°

C. is not more than 10×

10<sup>−

6</sup>/°

C., an iron alloy containing 27 to 50 mass % of nickel, or the iron alloy in which the nickel is substituted with not more than 20 mass % of cobalt.

4. The multilayer circuit board according to claim 1, wherein the second metal layer is copper.

5. An electronic apparatus comprising a multilayer circuit board comprising a laminate of at least one insulating resin layer and at least one wiring layer, on which multilayer circuit semiconductor devices are directly bonded,

wherein the multilayer circuit board comprises the multilayer circuit board according to claim 1.

6. A multilayer circuit board comprising at least one wiring layer formed in insulating layers, wherein at least one of the wiring layers is formed by a composite material comprising a first metal layer and a second metal layer formed on either side of the first metal layer, the first metal layer having a smaller coefficient of thermal expansion than the second metal layer, the second metal layer having a higher electric conductivity than the first metal layer, wherein the insulating layers facing one another via the composite material have a blind via-hole whose bottom portion is formed by a surface of the second metal layer, wherein the circuit board further comprises a layer-to-layer interconnection portion on the surface of the insulating layer and in the blind via-hole, wherein the layer-to-layer interconnection portion in each blind via-hole is formed in such a manner as to be in contact with the second metal layer surface.

7. A multilayer circuit board comprising a laminate of at least one insulating layer and a plurality of wiring layers separated one another by said insulating layer, wherein at least one of the wiring layers is formed by a composite material comprising an iron-nickel alloy layer having a copper layer formed on one or both sides thereof, wherein the insulating layer in contact with a surface of the copper layer has a blind via-hole whose bottom portion is constituted by a surface of the copper layer, wherein a layer-to-layer interconnection portion is provided on the surface of the insulating layer and in the blind via-hole, the layer-to-layer interconnection portion being formed in such a manner as to be in contact with the copper layer surface.

8. A multilayer circuit board comprising insulating layers in which at least one wiring layer is formed, wherein at least one of the wiring layers is formed by a composite material of an iron-nickel alloy having a copper layer formed on both sides thereof, wherein each of the insulating layers facing one another via the composite material has a blind via-hole whose bottom portion is constituted by a surface of the second metal layer, wherein the circuit board further comprises a layer-to-layer interconnection portion on the surface of the insulating layer and in the blind via-hole, wherein the layer-to-layer interconnection portion in each blind via-hole is formed in such a manner as to be in contact with the second metal layer surface.

9. A process of manufacturing a multilayer circuit board in which at least one insulating layer and a plurality of wiring layers separated from one another by the insulating layer are laminated, the process comprising the steps of:

forming a wiring on the wiring layer in a composite material including the wiring layer and the insulating layer integrally formed on the wiring layer, the wiring layer including a second metal layer formed on one or both sides of a first metal layer,

wherein the second metal layer has a larger coefficient of thermal expansion than the first metal layer;

forming a blind via-hole in the insulating layer such that a bottom portion of the via-hole is formed by a surface of the second metal layer;

forming a layer-to-layer interconnection portion on the surface of the insulating layer, and in the blind via-hole and the composite material and the wiring layers are in a layer-to-layer interconnection with one another through a layer-to-layer interconnection portion which is in contact with the second metal layer formed in the blind via-hole.

10. An electronic apparatus comprising a multilayer circuit board comprising a laminate of at least one insulating resin layer and at least one wiring layer, on which multilayer circuit semiconductor devices are directly bonded,

wherein the multilayer circuit board is manufactured according to the method described in claim 9, and

wherein the composite material and the wiring layers are in a layer-to-layer interconnection with one another through a layer-to-layer interconnection portion which is in contact with the second metal layer formed in the blind via-hole.

11. A process of manufacturing multilayer circuit board comprising an insulating layer in which at least one wiring layer is formed, the process comprising the steps of:

forming a wiring on the wiring layer in a composite material including the wiring layer and the insulating layer integrally formed on the wiring layer, the wiring layer comprising a second metal layer formed on one or both sides of a first metal layer,

wherein the second metal layer has a larger coefficient of thermal expansion than the first metal layer;

forming a blind via-hole in each insulating layer on the opposite surface between which the wiring layer is inserted, the blind via-hole having a bottom portion formed by a surface of the second metal layer; and

forming a layer-to-layer interconnection portion on the surface of the insulating layers in each blind via-hole and the composite material and wiring layers are in a layer-to-layer interconnection with one another through a layer-to-layer interconnection portion which is in contact with the second metal metal layer formed in the blind via-hole.

12. A process of manufacturing a multilayer circuit board comprising the steps of:

preparing a wiring layer formed by a composite material including a first metal layer and a second metal layer formed on one or both sides of the first metal layer, the second metal layer having a higher electric conductivity and a greater coefficient of thermal expansion than the first metal layer;

forming a substrate for multilayer circuitry by laminating the wiring layer on one or both sides of an insulating resin layer;

forming a predetermined wiring on the wiring layer;

covering the wiring formed in the wiring forming step with an insulating layer;

forming a blind via-hole in the insulating layer, or the insulating layer and insulating resin layer, the blind via-hole having a bottom portion formed by a surface of the second metal layer; and

forming a layer-to-layer interconnection portion on the surface of the insulating layer and in the blind via-hole and the composite material and wiring layers are in a layer-to-layer interconnection with one another through a layer-to-layer interconnection portion which is in contact with the second metal layer formed in the blind via-hole.

13. A process of manufacturing a multilayer circuit board comprising the steps of:

preparing a wiring layer formed by a composite material comprising a first metal layer and a second metal layer formed on both sides of the first metal layer, the second metal layer having a higher electric conductivity and a greater coefficient of thermal expansion than the first metal layer;

forming a substrate for multilayer circuitry by laminating the wiring layer on both sides of an insulating layer;

forming a predetermined wiring on the wiring layer formed in the wiring preparing step;

covering the wiring formed in the wiring forming step with an insulating layer;

forming a blind via-hole in each insulating layer, or the insulating layer and insulating resin layer on the opposite surfaces between which the insulating layer is inserted, the blind via-hole having a bottom portion formed by a surface of the second metal layer; and

forming a layer-to-layer interconnection portion on the surface of the insulating layer and in the blind via-hole and the composite material and wiring layers are in a layer-to-layer interconnection with one another through a layer-to-layer interconnection portion which is in contact with the second metal layer formed in the blind via-hole.