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Forming interconnects using locally deposited solvents

  • US 7,098,061 B2
  • Filed: 06/21/2002
  • Issued: 08/29/2006
  • Est. Priority Date: 12/21/1999
  • Status: Expired due to Term
First Claim
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1. A method for forming an electronic device, comprising:

  • forming a first conductive or semiconductive layer;

    forming a sequence of at least one insulating layer and at least one semiconducting layer over the first conductive or semiconductive layer;

    locally depositing solvents at a localised region of the sequence so as to than a void in the sequence with material dissolved to form said void being redeposited at a side of the void; and

    depositing conductive or semiconductive material in the void.

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