Integrated lid formed on MEMS device

• US 7,098,065 B2
• Filed: 09/28/2004
• Issued: 08/29/2006
• Est. Priority Date: 09/28/2004
• Status: Active Grant

• Current Assignee: STMicroelectronics Incorporated (STMicroelectronics NV)
• Original Assignee: STMicroelectronics Incorporated (STMicroelectronics NV)
• Inventors: Siegel, Harry Michael, Chiu, Anthony M.
• Primary Examiner(s): Fourson, George
• Assistant Examiner(s): Parker, John M.
• Application Number:
  US10/952,183
• Publication Number:
  US 20060065961A1
• Time in Patent Office: 700 Days
• Field of Search: 438/51, 438/FOR.432, 735/143.2, 257/415, 148/DIG.159
• US Class Current: 438/51
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: B81C 2203/0136 Growing or depositing of a covering layer
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid
• CPC Class Codes: B81C 2203/0163 Reinforcing a cap, e.g. with ribs

Abstract

An integrated lid for microelectromechanical system (MEMS) devices is formed from a nitride layer deposited over a cavity containing movable parts for the device. Pillars are formed through openings within large area movable parts to support the lid over those parts. Slides are formed and moved under large etchant openings through the lid to allow the openings to be sealed by sputtering.

Claims

1. An integrated circuit structure comprising:

a cavity within a substrate;

an integrated lid over the cavity having an opening therethrough;

a first movable element disposed within the cavity, the first movable element having an opening therethrough and adapted for physical movement in at least one direction within the cavity; and

a pillar extending from a bottom of the cavity through the opening in the first movable element to an inner surface of the integrated lid;

wherein the opening through the lid is sealed using a second movable element within the cavity.

2. The integrated circuit structure according to claim 1, wherein:

the second movable element is disposed beneath the opening through the lid; and

the opening through the lid is sealed using a material formed between the second movable element and the lid.

3. The integrated circuit structure according to claim 2, wherein, prior to formation of the material between the second movable element and the lid, the second movable element is selectively movable between:

a first position within the cavity wherein the second movable element is not disposed beneath the opening through the lid; and

a second position within the cavity wherein the second movable element is disposed beneath the opening through the lid.

4. The integrated circuit structure according to claim 1, wherein the second movable element is tethered to a sidewall of the cavity.

5. The integrated circuit structure according to claim 1, wherein the second movable element is secured in position beneath the opening through the lid by at least one latch.

6. The integrated circuit structure according to claim 1, wherein the pillar has a width greater than a widest portion of the first movable element in a cross-section of the integrated circuit structure.

7. The integrated circuit structure according to claim 1, further comprising:

a sacrificial material within the cavity between the first movable element and sidewalls of the cavity, wherein the first movement element is capable of physical movement in the at least one direction within the cavity upon removal of the sacrificial material and any other sacrificial material within the cavity adjacent to the first movable element.

8. The integrated circuit structure according to claim 1, further comprising:

a sacrificial material within the cavity between the first movable element and the bottom of the cavity, wherein the first movement element is capable of physical movement in the at least one direction within the cavity upon removal of the sacrificial material and any other sacrificial material within the cavity adjacent to the first movable element.

9. The integrated circuit structure according to claim 1, further comprising:

a sacrificial material within the cavity between the first movable element and the lid, wherein the first movement element is capable of physical movement in the at least one direction within the cavity upon removal of the sacrificial material and any other sacrificial material within the cavity adjacent to the first movable element.

10. An integrated circuit structure comprising:

a cavity within a substrate;

an integrated lid over the cavity, the lid having an opening therethrough;

a slide within the cavity disposed beneath the opening through the lid; and

a material formed between the slide and the lid,

wherein the opening through the lid is sealed by the slide and the material formed between the slide and the lid.

11. The integrated circuit structure according to claim 10, further comprising:

a moving part disposed within the cavity, the moving part having an opening therethrough and adapted to be selectively capable of physical movement in at least one direction within the cavity; and

a pillar extending from a bottom of the cavity through the opening in the moving part to an inner surface of the integrated lid.

12. The integrated circuit structure according to claim 11, wherein the pillar has a width greater than a widest portion of the moving part in a cross-section of the integrated circuit structure.

13. The integrated circuit structure according to claim 10, wherein, prior to formation of the material between the slide and the lid, the slide is selectively movable between:

a first position within the cavity wherein the slide is not disposed beneath the opening through the lid; and

a second position within the cavity wherein the slide is disposed beneath the opening through the lid.

14. The integrated circuit structure according to claim 10, wherein the slide is tethered to a sidewall of the cavity.

15. The integrated circuit structure according to claim 10, wherein the slide is secured in position beneath the opening through the lid by at least one latch.

16. The integrated circuit structure according to claim 11, further comprising:

a sacrificial material within the cavity between the moving part and sidewalls of the cavity, wherein the moving part is capable of physical movement in the at least one direction within the cavity upon removal of the sacrificial material and any other sacrificial material within the cavity adjacent to the moving part.

17. The integrated circuit structure according to claim 11, further comprising:

a sacrificial material within the cavity between the moving part and the bottom of the cavity, wherein the moving part is capable of physical movement in the at least one direction within the cavity upon removal of the sacrificial material and any other sacrificial material within the cavity adjacent to the moving part.

18. The integrated circuit structure according to claim 11, further comprising:

a sacrificial material within the cavity between the moving part and the lid, wherein the moving part is capable of physical movement in the at least one direction within the cavity upon removal of the sacrificial material and any other sacrificial material within the cavity adjacent to moving part.

19. A method of forming an integrated circuit structure, the method comprising:

forming a cavity within a substrate;

forming a moving part within the cavity, the moving part having an opening therethrough and adapted for physical movement in at least one direction within the cavity;

forming an integrated lid over the cavity; and

forming a pillar extending from a bottom of the cavity through the opening in the moving part to an inner surface of the integrated lid;

wherein the pillar has a width greater than a widest portion of the moving part in a cross-section of the integrated circuit structure.

20. The method according to claim 19, further comprising:

forming a sacrificial material within the cavity between the moving part and at least one of;

sidewalls of the cavity, the bottom of the cavity, and the lid, wherein the moving part is capable of physical movement in the at least one direction within the cavity upon removal of all sacrificial material within the cavity adjacent to the moving part.

21. A method of forming an integrated circuit structure, the method comprising:

forming a cavity within a substrate;

forming an integrated lid over the cavity, the lid having an opening therethrough;

forming a slide within the cavity disposed beneath the opening through the lid; and

forming a material between the slide and the lid, wherein the opening through the lid is sealed by the slide and the material formed between the slide and the lid.

22. The method according to claim 21, wherein, prior to formation of the material between the slide and the lid, the slide is selectively movable between:

a first position within the cavity wherein the slide is not disposed beneath the opening through the lid; and

a second position within the cavity wherein the slide is disposed beneath the opening through the lid.

23. The method according to claim 21, wherein the slide is tethered to a sidewall of the cavity.

24. The method according to claim 21, wherein the slide is secured in position beneath the opening through the lid by at least one latch.