Bumped IC, display device and electronic device using the same

• US 7,098,526 B2
• Filed: 01/28/2005
• Issued: 08/29/2006
• Est. Priority Date: 01/30/2004
• Status: Active Grant

• Current Assignee: 138 East LCD Advancements Limited (Vector Capital Corporation)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Kobayashi, Kazuo, Yajima, Hidehiko
• Primary Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US11/046,642
• Publication Number:
  US 20050167833A1
• Time in Patent Office: 578 Days
• Field of Search: 257/737, 257/738, 257/778, 257/786, 257/E23.21, 257/E23.069, 257/659, 257/660, 257/81, 257/82, 438613-617
• US Class Current: 257/660
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05026 the internal layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/051 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 2224/11003 for holding or transferring the bump preform
• CPC Class Codes: H01L 2224/11334 using preformed bumps
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A driver IC, which is mounted on an active matrix substrate by means of COG, is provided. The driver IC includes an input-output circuit, an internal circuit region having a plurality of internal circuits, a plurality of substrate-coupling bumps coupled to the input-output circuit, and at least one dummy bump. The dummy bump is placed facing opposite to one of the plurality of internal circuits which becomes an object of light shielding.

Claims

1. A bumped IC, comprising:

an input-output circuit;

a plurality of internal circuits;

a plurality of substrate-coupling bumps which are coupled to the input-output circuit; and

at least one dummy bump,

wherein the at least one dummy bump is placed opposite to at least one of the internal circuits which becomes an object of light shielding.

2. The bumped IC according to claim 1, wherein a height of the at least one dummy bump is lower than a height of each of the plurality of substrate-coupling bumps.

3. The bumped IC according to claim 1, further comprising a dummy electrode which is coupled to the at least one dummy bump, wherein the at least one dummy electrode is a floating electrode.

4. The bumped IC according to claim 1, wherein one of the plurality of internal circuits is an internal power supply circuit;

and the at least one of the internal circuits which becomes an object of light shielding is an analog circuit which is provided on the internal power supply circuit.

5. The bumped IC according to claim 4, wherein the analog circuit includes an element which has a temperature-voltage dependency.

6. The bumped IC according to claim 4, wherein the analog circuit includes a temperature sensor which detects an actual temperature based on the temperature-voltage dependency.

7. A display device, comprising:

the bumped IC according to claim 1; and

a transparent substrate on which the bumped IC is mounted by means of chip-on-glass (COG),

wherein the transparent substrate has a plurality of wires and the plurality of substrate-coupling bumps on the bumped IC are coupled to the plurality of wires.

8. An electronic device, comprising the display device according to claim 7.