Two-dimensional structure for determining an overlay accuracy by means of scatterometry
First Claim
1. A structure for estimating an overlay accuracy in forming successive material layers on a substrate during the course of manufacture of integrated circuit devices, the structure comprising:
- a substrate comprised of a semiconductor material having formed thereon a plurality of first and second regions, wherein the first region and the second region differ from each other in at least one of type of material and surface topology, the first and the second regions arranged to form a periodic pattern having a predefined first periodicity along a first direction and along a second direction; and
a plurality of third regions, each of which overlies one of said second regions so as to exhibit a predefined second periodicity, with a pitch that is substantially equal to a pitch of said periodic pattern, along the first and the second directions, wherein the size of the first, the second and the third regions is selected so that each third region lies within the respective second region for a given maximum overlay inaccuracy.
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Accused Products
Abstract
A two-dimensional periodic pattern that is symmetrical with respect to a first and a second direction allows the determination of an overlay accuracy that is obtained during the fabrication of the two-dimensional structure. Due to the symmetry of the structure, the overlay accuracy in the first direction may be determined on the basis of substantially the same reference data as used for the determination of the overlay accuracy of the second direction so that establishing libraries is simplified. Moreover, depending on the capability of the metrology tool, the overlay accuracy in both directions may be obtained simultaneously.
42 Citations
20 Claims
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1. A structure for estimating an overlay accuracy in forming successive material layers on a substrate during the course of manufacture of integrated circuit devices, the structure comprising:
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a substrate comprised of a semiconductor material having formed thereon a plurality of first and second regions, wherein the first region and the second region differ from each other in at least one of type of material and surface topology, the first and the second regions arranged to form a periodic pattern having a predefined first periodicity along a first direction and along a second direction; and a plurality of third regions, each of which overlies one of said second regions so as to exhibit a predefined second periodicity, with a pitch that is substantially equal to a pitch of said periodic pattern, along the first and the second directions, wherein the size of the first, the second and the third regions is selected so that each third region lies within the respective second region for a given maximum overlay inaccuracy. - View Dependent Claims (2, 3, 4, 5)
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6. A method of forming a semiconductor device, including a structure for determining an overlay accuracy, the method comprising:
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forming a first material layer on a surface of a substrate, the first material layer including a plurality of first regions of a first optical characteristic and a plurality of second regions of a second optical characteristic, wherein the first and the second regions differ from each other in at least one of type of material and surface topology, the first and second regions arranged to form a two-dimensional periodic pattern with a predefined periodicity along a first direction and a second direction that are substantially parallel to said surface; aligning said substrate with respect to a second material layer to be formed; and forming said second material layer, the second material layer including a plurality of third regions, each of the third regions partially covering a respective one of said second regions, wherein a relative position of the third region with respect to the second region is indicative of the overlay accuracy of the first and second material layers with respect to the first and second directions. - View Dependent Claims (7, 8, 9)
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10. A method of monitoring an overlay accuracy in manufacturing a semiconductor device, the method comprising:
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identifying a structure including a plurality of first and second regions, wherein the first and the second regions differ from each other in at least one of type of material and surface topology, the first and second regions arranged to form a periodic pattern having a predefined first periodicity along a first direction and along a second direction, a plurality of third regions, each of which overlies one of said second regions so as to exhibit a predefined second periodicity along the first and the second directions; directing a first light beam onto said structure under an angle of incidence such that a portion of the first light beam is reflected to form a first reflected light beam, wherein the first light beam and the first reflected light beam form a plane of incidence that is substantially parallel to said first direction; detecting said first reflected light beam to obtain a first measurement data; estimating an overlay accuracy with respect to said first direction on the basis of the first measurement data and reference data; directing a second light beam onto said structure under an angle of incidence such that a portion of the second reflected light beam is reflected to form a second reflected light beam, wherein the second light beam and the second reflected light beam form a plane of incidence that is substantially parallel to the second direction; detecting said second reflected light beam to obtain a second measurement data; and estimating an overlay accuracy with respect to the second direction on the basis of the second measurement data and reference data. - View Dependent Claims (11, 12, 13)
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14. A substrate comprised of a semiconductor material comprising a plurality of chip areas and at least one structure for estimating an overlay accuracy in forming successive material layers on said substrate, said structure including a plurality of first and second regions, wherein the first and the second regions differ from each other in at least one of type of material and surface topology, the first and second regions arranged to form a periodic pattern having a predefined first periodicity along a first direction and along a second direction, and a plurality of a third regions, each of which overlies one of the second regions so as to exhibit a predefined second periodicity along the first and the second directions, and wherein at least some of said chip areas are separated from each other by scribe lines and said at least one structure is located in at least one of the scribe lines.
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15. A structure for estimating an overlay accuracy in forming successive material layers on a substrate, the structure comprising:
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a substrate having formed thereon a plurality of first and second regions, the first and the second regions arranged to form a periodic pattern having a predefined first periodicity along a first direction and along a second direction; and a plurality of third regions, each of which overlies one of said second regions so as to exhibit a predefined second periodicity, with a pitch that is substantially equal to a pitch of said periodic pattern, along the first and the second directions, wherein the size of the first, the second and the third regions is selected so that each third region lies within the respective second region for a given maximum overlay inaccuracy. - View Dependent Claims (16, 17)
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18. A method of forming a semiconductor device, including a structure for determining an overlay accuracy, the method comprising:
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forming a first material layer on a surface of a substrate, the first material layer including a plurality of first regions of a first optical characteristic and a plurality of second regions of a second optical characteristic, the first and second regions arranged to form a two-dimensional periodic pattern with a predefined periodicity along a first direction and a second direction that are substantially parallel to said surface; aligning said substrate with respect to a second material layer to be formed; and forming said second material layer, the second material layer including a plurality of third regions, each of the third regions partially covering a respective one of said second regions, wherein a relative position of the third region with respect to the second region is indicative of the overlay accuracy of the first and second material layers with respect to the first and second directions, wherein a size of the first, the second and the third regions is selected so that each third region is formed within the respective second region for a given maximum overlay inaccuracy. - View Dependent Claims (19, 20)
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Specification