Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
First Claim
Patent Images
1. An apparatus for controlling the temperature of an electronic device under test, said apparatus comprising:
- a refrigeration system including a compressor and a condenser, said refrigeration system being operative to circulate a refrigerant fluid will change between gaseous and liquid states to alternately absorb and release thermal energy;
an evaporator head connected into said fluid flow loop, said evaporator head having a temperature controlled surface;
a support structure in spaced apart relation to said evaporator head, said support structure having a manifold configured to route said refrigerant fluid between said evaporator head and components of said refrigeration system;
a mechanical isolation assembly situated between said evaporator head and said support structure so as to compensate for variations in the planar orientation of said device under test; and
said mechanical isolation assembly including an inflow bellows and an outflow bellows located side by side to one another, inflow bellows providing inflow of said refrigerant fluid from said evaporator head to said support structure.
7 Assignments
0 Petitions
Accused Products
Abstract
An apparatus and method for controlling the temperature of an electronic device under test utilizes a thermal head spaced apart from a movable support structure by a mechanical isolation assembly. The support structure has a manifold configured to route refrigerant fluid between the evaporator head and components of a refrigeration system. The mechanical isolation assembly is configured to compensate for variations in the planar orientation of the device under test. Moreover, the mechanical isolation assembly preferably includes bellows through which the refrigerant fluid is conducted.
102 Citations
38 Claims
-
1. An apparatus for controlling the temperature of an electronic device under test, said apparatus comprising:
-
a refrigeration system including a compressor and a condenser, said refrigeration system being operative to circulate a refrigerant fluid will change between gaseous and liquid states to alternately absorb and release thermal energy; an evaporator head connected into said fluid flow loop, said evaporator head having a temperature controlled surface; a support structure in spaced apart relation to said evaporator head, said support structure having a manifold configured to route said refrigerant fluid between said evaporator head and components of said refrigeration system; a mechanical isolation assembly situated between said evaporator head and said support structure so as to compensate for variations in the planar orientation of said device under test; and said mechanical isolation assembly including an inflow bellows and an outflow bellows located side by side to one another, inflow bellows providing inflow of said refrigerant fluid from said evaporator head to said support structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. An apparatus for controlling the temperature of an electronic device under test, said apparatus comprising:
-
a refrigeration system including a compressor and a condenser, said refrigeration system being operative to circulate a refrigerant fluid through a fluid flow loop such that said refrigerant fluid will change between gaseous and liquid states to alternately absorb and release thermal energy; an evaporator head connected into said fluid flow loop, said evaporator head having a temperature controlled surface; a support structure in spaced apart relation to said evaporator head, said support structure being movable between a retracted position farther from said device under test and an extended position closer to said device under test; a source of pressurized gas; a mechanical isolation assembly including a controllable bellows situated between said support structure and said evaporator head, said controllable bellows being in fluid communication with said source of pressurized gas so as to selectively vary an engagement force between said evaporator head and said device under test. - View Dependent Claims (11, 12, 13, 14, 15, 16)
-
-
17. An apparatus comprising:
-
a thermal head defining a passage for flow of refrigerant fluid therethrough, said thermal head having a temperature controlled surface for engagement with an electronic device; a support structure in spaced apart relation to said thermal head, said support structure having a manifold configured to route said refrigerant fluid; a mechanical isolation assembly situated between said thermal head and said support structure so as to compensate for variations in the planar orientation of said electronic device; said mechanical isolation assembly including an inflow bellows and an outflow bellows, said inflow bellows providing inflow of said refrigerant fluid into said thermal head from said support structure and said outflow bellows providing outflow of said refrigerant fluid from said thermal head to said support structure; and said mechanical isolation assembly further including a controllable mechanism operative to selectively vary an engagement force between said thermal head and said electronic device. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
-
-
30. A method of engaging an electronic device to be tested with a thermal head at a selected force, said method comprising steps of:
-
(a) providing an arrangement wherein said thermal head is separated from a support structure by an intervening mechanical isolation assembly, said mechanical isolation assembly having a controllable bellows; (b) moving said support structure from a retracted position farther from said electronic device to an extended position closer to said electronic device; and (c) introducing pressurized gas into said controllable bellows so as to cause said thermal head to engage said electronic device with said selected force.
-
-
31. An apparatus for controlling the temperature of an electronic device under test, said apparatus comprising:
-
a thermal head defining a passage for flow of refrigerant fluid therethough, said thermal head having a temperature controlled surface for engagement with an electronic device; a support structure in spaced apart relation to said thermal head, said support structure having a manifold configured to route said refrigerant fluid; a mechanical isolation assembly including an inflow bellows and an outflow bellows, said inflow bellows providing inflow of said refrigerant fluid into said thermal head from said support structure and said outflow bellows providing outflow of said refrigerant fluid from said thermal head to said support structure; and said mechanical isolation assembly including a separation element extending between said thermal head and said support structure, said separation element being pivotal so as to allow variations in a planar orientation of said temperature controlled surface. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38)
-
Specification