Accelerometer

• US 7,100,448 B2
• Filed: 09/22/2004
• Issued: 09/05/2006
• Est. Priority Date: 11/10/2003
• Status: Expired due to Fees

• Current Assignee: LAPIS Semiconductor Co., Ltd. (ROHM Co., Ltd.)
• Original Assignee: OKI Electric Industry Company Limited
• Inventors: Ikegami, Naokatsu
• Primary Examiner(s): KWOK, HELEN C
• Application Number:
  US10/945,889
• Publication Number:
  US 20050097958A1
• Time in Patent Office: 713 Days
• Field of Search: 735/143.3, 735/141.6, 735/142.9, 735/143.6, 735/143.8
• US Class Current: 73/514.33
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 2015/084 the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
• CPC Class Codes: G01P 2015/0842 the mass being of clover leaf shape

Abstract

An accelerometer includes: a sensor chip including a weight portion for detecting a force imparted from outside, a frame portion that surrounds the weight portion, a beam portion that is deflectable and flexibly supports the weight portion, and a sensor element whose electric resistance varies depending on an amount by which the beam portion deflects; and a spacer provided at a position on a surface of a mounting substrate which position corresponds to the central portion of the weight portion. The sensor chip is mounted on the mounting substrate with a bottom surface of the frame portion being fixed at a predetermined position on the mounting substrate by an adhesive portion. The spacer has a thickness greater than that of the adhesive portion and may be formed by an adhesive concurrently with the adhesive portion, with a gap being maintained between the bottom surface of the weight portion and the spacer. The spacer serves to restrict an amount of downward movement of the weight portion which occurs when the beam portion deflects.

Claims

1. An accelerometer, comprising:

a sensor chip including a weight portion that detects force imparted from outside, a frame portion that surrounds the weight portion, a beam portion that flexibly supports the weight portion by connecting an upper portion of the weight portion to an upper portion of the frame portion so that a bottom surface of the weight portion is placed at a position higher than a the bottom surface of the frame portion by a predetermined amount, and a sensor element having electric resistance that varies depending on an amount by which the beam portion deflects;

a mounting substrate on which said sensor chip is mounted by fixing the bottom surface of the frame portion of said sensor chip at a predetermined position using an adhesive portion having a first thickness applied thereto; and

a spacer formed from an adhesive applied at a position on a surface of said mounting substrate, which position corresponds to a central position of the weight portion of said sensor chip, by an amount of a second thickness that is larger than said first thickness, with a predetermined gap being formed between the bottom surface of the weight portion and said spacer, said spacer being provided so as to restrict an amount of movement of said weight portion in a downward directions;

wherein the adhesive that forms said spacer, and said adhesive portion, are formed from a same adhesive material, with said spacer and said adhesive portion being formed at a same time.

2. The accelerometer according to claim 1, wherein said spacer is formed from the same adhesive and at the same time as the adhesive portion of the frame portion of said sensor chip in, by applying the adhesive as one pattern.

3. The accelerometer according to claim 1, wherein the sensor chip is formed on a surface of said beam portion and is connected to a connecting pad formed on a surface of said frame portion.

4. The accelerometer according to claim 1, wherein said weight portion, said frame portion, said beam portion and said sensor element of said sensor chip are integrally formed on a semiconductor substrate.

5. The accelerometer according to claim 1, wherein the frame portion of said sensor chip has a thickness that is about 50 μ

m larger than that of the weight portion, said spacer has a thickness of about 50 μ

m, the adhesive portion of said frame portion has a thickness of about 25 μ

m, and a gap formed between the bottom surface of the weight portion and said spacer is about 25 μ

m.

6. An accelerometer, comprising:

a sensor chip including a weight portion that detects force imparted from outside, a frame portion that surrounds the weight portion, a beam portion that flexibly supports the weight portion by connecting an upper portion of the weight portion to an upper portion of the frame portion so that a bottom surface of the weight portion is placed at a position higher than a bottom surface of the frame portion by a predetermined amount, and a sensor element having electric resistance that varies depending on an amount by which the beam portion deflects;

a receptacle that is formed by an exterior frame portion and a bottom portion and has a space that is large enough to accommodate said sensor chip, in which said sensor chip is mounted and disposed within the space in such a manner that the bottom surface of the frame portion of said sensor chip is fixed to the bottom portion using an adhesive portion having a first thickness applied thereto; and

a spacer formed from an adhesive applied at a position on a bottom surface of said receptacle, which position corresponds to a central position of the weight portion of said sensor chip, by an amount of a second thickness that is larger than said first thickness, with a predetermined gap being formed between the bottom surface of the weight portion and said spacer, said spacer being provided so as to restrict an amount of movement of said weight portion in a downward directions;

wherein the adhesive that forms said spacer, and said adhesive portion, are formed from a same adhesive material, with said spacer and said adhesive portion being formed at a same time.

7. The accelerometer according to claim 6, wherein a first connecting pad is provided on an upper surface of the frame portion of said sensor chip, a second connecting pad is provided on an upper surface of the exterior frame portion of said receptacle, and the first connecting pad is connected to the second connecting pad.

8. An accelerometers comprising:

a sensor chip including a square column-shaped central weight portion and square column-shaped peripheral weight portions respectively connected to four corners of the central weight portion, which weight portions are provided for detecting force imparted from an outside, a rectangular parallelepiped-shaped frame portion that surrounds the central weight portion and the peripheral weight portions, four beam portions which flexibly support the central weight portion by connecting upper portions of four sides of the central weight portion respectively to upper portions of four sides of the frame portion so that a bottom surface of the central weight portion is placed at a position higher than a bottom surface of the frame portion by a predetermined amount, and a sensor element whose electric resistance value varies depending on an amount by which the beam portions deflect, all of which components are integrally formed on a semiconductor substrate;

a mounting receptacle formed by an exterior frame portion and a bottom portion and having a space that is large enough to accommodate said sensor chip, said receptacle being provided in such a manner that said sensor chip is disposed and mounted in the space by fixing the bottom surface of the frame portion of said sensor chip at a predetermined position on a surface of the bottom portion using an adhesive portion having a first thickness applied thereto; and

a spacer formed, from an adhesive, and having a second thickness larger than said first thickness, at a position on the surface of the bottom portion surface of said receptacle, which position corresponds to a central position of the central weight portion of said sensor chip, with a predetermined gap being formed between the bottom surface of the central weight portion and said spacer, said spacer being provided so as to restrict an amount of movement of said central weight portion in a downward directions,

wherein the adhesive that forms said spacer, and said adhesive portion, are formed from a same adhesive material, with said spacer and said adhesive portion being formed at a same time, and as one pattern.

9. The accelerometer according to claim 8, wherein said mounting receptacle is a box-shaped receptacle having an open top side.