Transceiver assembly for use in fiber optics communications

• US 7,101,090 B2
• Filed: 03/02/2006
• Issued: 09/05/2006
• Est. Priority Date: 09/17/2001
• Status: Expired due to Fees

• Current Assignee: Stratos International Incorporated (Emerson Electric Company)
• Original Assignee: Stratos International Incorporated (Emerson Electric Company)
• Inventors: Kim, Brian, Cheng, Hengju, Chin, Jesse, Crews, Darren, Xu, Lee L.
• Primary Examiner(s): Assaf, Fayez G.
• Application Number:
  US11/366,896
• Publication Number:
  US 20060147159A1
• Time in Patent Office: 187 Days
• Field of Search: 385/88, 385/89, 385/92, 385/49, 385/90
• US Class Current: 385/88
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4261 Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]
• CPC Class Codes: G02B 6/4281 the printed circuit boards being flexible in general H05K1/147
• CPC Class Codes: G02B 6/4283 with electrical insulation means
• CPC Class Codes: G02B 6/4284 of optical modules with disconnectable electrical connectors latching arms for electrical connectors H01R13/627
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence

Abstract

An optoelectronic subassembly includes a planar substrate, a set of guide pins, and a support block. The planar substrate has an array of photoactive components mounted on the planar substrate and a set of apertures in the planar substrate are aligned with the photoactive components. The set of guide pins have proximal and distal ends extending through the set of apertures in the planar substrate. The support block includes a set of support passages in which the distal ends of the guide pins are cemented, and a support face which is at right angles to the set of support passages. The optoelectronic subassembly is for use in a fiber optic communications transceiver which is adapted for being mechanically and optically connected to an optical ferrule. The optical ferrule supports an array of optical communications fibers.

Claims

1. An optoelectronic subassembly for use in a fiber optic communications transceiver which is adapted for being mechanically and optically connected to an optical ferrule supporting an array of optical communication fibers, said optoelectronic subassembly comprising:

a) a planar substrate including an array of photoactive components mounted on said planar substrate and a set of apertures in said planar substrate which are aligned with said array of photoactive components, and wherein said planar substrate comprises a silicon substrate and said set of apertures are fabricated using photolithography techniques;

b) a set of guide pins having proximal and distal ends extending through said set of apertures in said planar substrate;

c) a support block having a set of support passages in which the distal ends of said set of guide pins are cemented and having a support face at right angles to said set of support passages on which said planar substrate is mounted;

d) one or more alignment marks deposited on said planar substrate using photolithography techniques;

e) an optoelectronic device containing said array of photoactive components positioned and secured on said planar substrate with reference to said one or more alignment marks;

f) a window section etched in said planar substrate using photolithography techniques; and

g) a transparent film layer deposited on said planar substrate over said window section on which said one or more alignment marks are deposited.