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Bilevel probe

  • US 7,102,371 B1
  • Filed: 05/19/2004
  • Issued: 09/05/2006
  • Est. Priority Date: 05/19/2004
  • Status: Active Grant
First Claim
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1. An apparatus for electrical testing of semiconductor devices, comprising:

  • a printed circuit board;

    a first plurality of probe pins for probing bump connectors electrically and mechanically connected to the printed circuit board, wherein said first plurality of probe pins are connected to circuitry for trimming said printed circuit board; and

    a second plurality of probe pins for probing probe pads electrically and mechanically connected to the printed circuit board, wherein said second plurality of probe pins are connected to circuitry for testing said printed circuit board, wherein each probe pin of the first plurality of probe pins has a tip, wherein each tip of the first plurality of probe pins is arranged to lie on a first plane and wherein each probe pin of the second plurality of probe pins has a tip, wherein each tip of the second plurality of probe pins is arranged to lie on a second plane different from the first plane.

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