RFID device and method of forming
First Claim
Patent Images
1. A radio frequency identification (REID) device comprising:
- an antenna substrate having at least a recess therein;
an antenna on the antenna substrate; and
an interposer, wherein the interposer includes;
an RFID chip having contacts thereupon; and
interposer leads operatively coupled to the contacts of the chip;
wherein the interposer leads and the antenna are electrically coupled together;
wherein at least part of the interposer is within the at least a recess; and
wherein the interposer leads and the antenna are capacitively coupled together across a dielectric material.
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Abstract
A radio frequency identification (RIFD) inlay includes an interposer that has a chip, and an antenna on an antenna substrate. The antenna substrate has a recess or hole, and the chip is at least partially in the recess or hole. By placing the chip or the interposer face down and at least partially in a recess or hole, thickness of the inlay may be reduced.
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Citations
25 Claims
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1. A radio frequency identification (REID) device comprising:
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an antenna substrate having at least a recess therein; an antenna on the antenna substrate; and an interposer, wherein the interposer includes; an RFID chip having contacts thereupon; and interposer leads operatively coupled to the contacts of the chip; wherein the interposer leads and the antenna are electrically coupled together; wherein at least part of the interposer is within the at least a recess; and wherein the interposer leads and the antenna are capacitively coupled together across a dielectric material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of forming an RFID device, the method comprising:
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forming an interposer, wherein the forming includes electrically coupling interposer leads of the interposer to contacts of an RFID chip of the interposer; forming at least a recess in an antenna substrate that has an antenna thereupon; and subsequent to the forming at least a recess, mechanically coupling the interposer and the antenna substrate together; wherein the mechanically coupling includes placing at least part of the chip in the at least a recess; and wherein the mechanically coupling also includes capacitively coupling the interposer leads and the antenna. - View Dependent Claims (21, 22, 23, 24, 25)
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Specification