Electronic component module

• US 7,102,896 B2
• Filed: 05/18/2004
• Issued: 09/05/2006
• Est. Priority Date: 05/19/2003
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Shimoda, Hideaki, Ikeda, Hiroshi, Asami, Shigeru, Ajioka, Eriko, Kurata, Hitoyoshi, Yamashita, Yoshinari
• Primary Examiner(s): Bui, Hung S.
• Application Number:
  US10/847,383
• Publication Number:
  US 20040233648A1
• Time in Patent Office: 840 Days
• Field of Search: 361/752, 361/753, 361/799, 361/800, 361/816, 361/818, 361/212, 361/220, 343/778, 343/789, 343/700.MS, 343/246, 343/247, 257/728, 174/35.R, 174/52.5
• US Class Current: 361/816
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2223/6688 Mixed frequency adaptations, i.e. for operation at different frequencies
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/81203 Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/1616 : Cavity shape
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/20109 : Temperature range 350 C=<T<400 C, 623.15K =<T< 673.15K
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/0407 : Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0298 : Multilayer circuits
• CPC Class Codes: H05K 1/183 : Components mounted in and supported by recessed areas of the printed circuit board

Abstract

An electronic component module according to the invention includes: a mounting substrate 11 including a shield layer 13 and on which a first cavity 14a and a second cavity 14b are formed; a first electronic component 16a positioned in the first cavity 14a and used in a first frequency band; a second electronic component 16b positioned in the second cavity 14b and used in a second frequency band; lid members 15 which seal the first cavity 14a and the second cavity 14b; and patch antennas 17 which transmit/receive radio waves in the frequency bands, the antennas connected to the electronic components 16; wherein the electronic components 16 are mounted on the mounting substrate 11 via a substrate component 19 having a higher heat resistance than the mounting substrate 11 and that the mounting substrate 11 is composed of a member having a lower dielectric constant that the substrate component 19.

Claims

1. An electronic component module comprising:

a mounting substrate including a shield layer and transmission lines and on which at least a first cavity and at least a second cavity are formed;

at least a first electronic component positioned in said first cavity and configured to be used in a first frequency band;

at least a second electronic component positioned in said second cavity and configured to be used in a second frequency band;

lid members equipped with a shielding feature configured to seal said first cavity and said second cavity;

one or more antennas formed on a surface of said mounting substrate, said one or more antennas being connected to at least one of said first and second electronic components; and

a plurality of terminals formed on said mounting substrate, said plurality of terminals connected to said first electronic component and said second electronic component via said transmission lines;

wherein at least one of said first and second electronic components is mounted on said mounting substrate via a substrate component having a higher heat resistance than a heat resistance of said mounting substrate and said mounting substrate is composed of a member having a lower dielectric constant than a dielectric constant of said substrate component.

2. The electronic component module according to claim 1, wherein said lid members include a metal or a nonmetal on which a metallic shield layer is formed.

3. The electronic component module according to claim 1, wherein said mounting substrate member includes a resin and said substrate component includes a ceramic.

4. The electronic component module according to claim 2, wherein said mounting substrate member includes a resin and said substrate component includes a ceramic.

5. The electronic component module according to claim 1, wherein said shield layer is formed on an outer wall of said mounting substrate and a partition wall of said mounting substrate.

6. The electronic component module according to claim 1, wherein said lid member and said shield layer being configured to electromagnetically shield said first cavity and said second cavity in all directions.

7. The electronic component module according to claim 1, wherein said one or more antennas transmit or receive radio waves in at least one of said first frequency band and said second frequency band.