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Electronic component module

  • US 7,102,896 B2
  • Filed: 05/18/2004
  • Issued: 09/05/2006
  • Est. Priority Date: 05/19/2003
  • Status: Active Grant
First Claim
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1. An electronic component module comprising:

  • a mounting substrate including a shield layer and transmission lines and on which at least a first cavity and at least a second cavity are formed;

    at least a first electronic component positioned in said first cavity and configured to be used in a first frequency band;

    at least a second electronic component positioned in said second cavity and configured to be used in a second frequency band;

    lid members equipped with a shielding feature configured to seal said first cavity and said second cavity;

    one or more antennas formed on a surface of said mounting substrate, said one or more antennas being connected to at least one of said first and second electronic components; and

    a plurality of terminals formed on said mounting substrate, said plurality of terminals connected to said first electronic component and said second electronic component via said transmission lines;

    wherein at least one of said first and second electronic components is mounted on said mounting substrate via a substrate component having a higher heat resistance than a heat resistance of said mounting substrate and said mounting substrate is composed of a member having a lower dielectric constant than a dielectric constant of said substrate component.

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