System and method for the manufacture of surgical blades
First Claim
1. A method for manufacturing a cutting device from a crystalline material, the method comprising:
- machining at least one blade profile in a wafer of crystalline material on a first side of the wafer of the crystalline material;
isotropically etching the wafer of crystalline material to form at least one surgical blade comprising the at least one blade profile; and
singulating the at least one surgical blades.
13 Assignments
0 Petitions
Accused Products
Abstract
A method for manufacturing surgical blades from either a crystalline or poly-crystalline material, preferably in the form of a wafer, is disclosed. The method includes preparing the crystalline or poly-crystalline wafers by mounting them and machining trenches into the wafers. The methods for machining the trenches, which form the bevel blade surfaces, include a diamond blade saw, laser system, ultrasonic machine, and a hot forge press. The wafers are then placed in an etchant solution which isotropically etches the wafers in a uniform manner, such that layers of crystalline or poly-crystalline material are removed uniformly, producing single or double bevel blades. Nearly any angle can be machined into the wafer which remains after etching. The resulting radii of the blade edges is 5–500 nm, which is the same caliber as a diamond edged blade, but manufactured at a fraction of the cost.
168 Citations
49 Claims
-
1. A method for manufacturing a cutting device from a crystalline material, the method comprising:
-
machining at least one blade profile in a wafer of crystalline material on a first side of the wafer of the crystalline material; isotropically etching the wafer of crystalline material to form at least one surgical blade comprising the at least one blade profile; and singulating the at least one surgical blades. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
-
-
30. A method for manufacturing a cutting device from a crystalline material, comprising:
-
mounting a wafer of crystalline material on a mounting assembly; pre-cutting the mounted wafer of crystalline material, such that a plurality of through hole fiducials are cut to assist in the machining step; machining at least one blade profile in the wafer of crystalline material on its first side; etching the wafer of crystalline material to form at least one surgical blade; singulating the etched crystalline material surgical blades; and radiating the singulated etched crystalline material surgical blades with ultra-violet light, to separate them from the mounting assembly, in preparation for packaging for sale. - View Dependent Claims (31, 32, 33, 34, 35)
-
-
36. A method for manufacturing a cutting device from a crystalline material, comprising:
-
mounting a wafer of crystalline material on a mounting assembly; pre-cutting the mounted wafer of crystalline material, such that a plurality slots are cut to assist in the machining step; machining at least one blade profile in the wafer of crystalline material on its first side; etching the wafer of crystalline material to form at least one surgical blade; singulating the etched crystalline material surgical blades; and radiating the singulated etched crystalline material surgical blades with ultra-violet light, to separate them from the mounting assembly, in preparation for packaging for sale. - View Dependent Claims (37, 38, 39, 40, 41)
-
-
42. A method for manufacturing a cutting device, the method comprising:
-
pre-cutting a wafer of a crystalline material, such that a plurality of through hole fiducials are cut to assist in a machining step; machining at least one blade profile in the wafer of the crystalline material; and etching the wafer of crystalline material to form at least one surgical blade. - View Dependent Claims (43, 44, 45)
-
-
46. A method for manufacturing a cutting device, the method comprising:
-
pre-cutting a wafer of a crystalline material, such that a plurality of slots are cut to assist in a machining step; machining at least one blade profile in the wafer of the crystalline material; and etching the wafer of crystalline material to form at least one surgical blade. - View Dependent Claims (47, 48, 49)
-
Specification