Method of increasing reliability of packaged semiconductor integrated circuit dice

• US 7,105,364 B2
• Filed: 09/14/2004
• Issued: 09/12/2006
• Est. Priority Date: 09/14/2004
• Status: Active Grant

• Current Assignee: Atmel Corporation (Microchip Technology Incorporated)
• Original Assignee: Atmel Corporation (Microchip Technology Incorporated)
• Inventors: Suciu, Paul I., Marcus, Kristopher R., Friedberg, Charles B.
• Primary Examiner(s): Pert, Evan
• Assistant Examiner(s): Kobert, Russell M
• Application Number:
  US10/940,128
• Publication Number:
  US 20060043998A1
• Time in Patent Office: 728 Days
• Field of Search: None
• US Class Current: 438/10
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

Semiconductor dice are electrically tested prior to final assembly. Dice failing the test are identified and not packaged. However, “good dice” (i.e., those dice that passed testing) in proximity to the failed dice frequently fail prematurely in the field. Therefore, in one embodiment, a method to identify those dice having a probability for early failure includes identifying a core die and a die cluster, adding the core die and at least one additional die from the die cluster to a weighted character map, and assigning a weighting value to each of the dice added to the weighted character map. At least one tier of buffer dice is then added to the weighted character map adjacent to each die on the weighted character map. Both the dice from the die cluster and the tier of buffer dice are marked, thereby preventing those dice from being packaged and consequently, shipped to customers.

Claims

1. A method to increase a reliability of packaged semiconductor integrated circuit dice, the method comprising:

identifying a die cluster, the die cluster consisting of dice having failed an electrical test;

identifying a core die from the die cluster;

adding the core die from the die cluster to a weighted character map;

adding at least one additional die from the die cluster to a weighted character map;

assigning a weighting value to each of the dice added to the weighted character map;

adding at least one tier of buffer dice to the weighted character map adjacent to each die on the weighted character map; and

indicating dice from the die cluster and tier of buffer dice, thereby indicating dice not requiring packaging.

2. The method of claim 1 wherein identifying a die cluster comprises determining whether a die which failed an electrical probe test is surrounded by a plurality of other dice which also failed the electrical probe test.

3. The method of claim 1 wherein identifying a core die comprises locating an electrically malfunctioning die surrounded by a plurality of other electrically malfunctioning dice.

4. The method of claim 1 wherein the step of adding at least one additional die from the die cluster to a weighted character map comprises locating an electrically malfunctioning die located adjacent to an edge of the core die.

5. The method of claim 1 wherein the step of adding at least one additional die is based on a weighting value of at least one of each of the dice previously added to the weighted character map.

6. The method of claim 1 wherein the weighting value for any particular die is determined by the number of electrically malfunctioning dice on the weighted character map surrounding and adjacent to an edge of the particular die.

7. The method of claim 1 wherein additional tiers of buffer dice are added to the weighted character map adjacent to a previous tier on the weighted character map.

8. The method of claim 7 wherein a maximum of three additional tiers of buffer dice are added to the weighted character map.