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Electronic package and method

  • US 7,105,931 B2
  • Filed: 01/06/2004
  • Issued: 09/12/2006
  • Est. Priority Date: 01/07/2003
  • Status: Expired due to Fees
First Claim
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1. An electronic package substrate for an electronic package, comprising:

  • an adhesive bonding member having two planar surfaces and an orifice there through for receiving a chip; and

    a circuitized member having two planar surfaces, one surface being bonded to one of the planar surfaces of the bonding member, said circuitized member being electrically connectable to the chip, said bonding member prior to assembly of the electronic package substrate being a stiff sheet of adhesive that is substantially not sticky and after curing said bonding member having mechanical and chemical adhesive bonds with the circuitized member.

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