Electronic package and method
First Claim
Patent Images
1. An electronic package substrate for an electronic package, comprising:
- an adhesive bonding member having two planar surfaces and an orifice there through for receiving a chip; and
a circuitized member having two planar surfaces, one surface being bonded to one of the planar surfaces of the bonding member, said circuitized member being electrically connectable to the chip, said bonding member prior to assembly of the electronic package substrate being a stiff sheet of adhesive that is substantially not sticky and after curing said bonding member having mechanical and chemical adhesive bonds with the circuitized member.
1 Assignment
0 Petitions
Accused Products
Abstract
An electronic package substrate for an electronic package that includes an adhesive bonding member having two planar surfaces and an orifice there through for receiving a chip and a circuitized member having two planar surfaces, one surface being bonded to one of the planar surfaces of the bonding member, the circuitized member being electrically connectable to the chip. The electronic package substrate is fabricated for an electronic package for either a wire bonded chip, a tab bonded chip, or a flip chip.
-
Citations
42 Claims
-
1. An electronic package substrate for an electronic package, comprising:
-
an adhesive bonding member having two planar surfaces and an orifice there through for receiving a chip; and a circuitized member having two planar surfaces, one surface being bonded to one of the planar surfaces of the bonding member, said circuitized member being electrically connectable to the chip, said bonding member prior to assembly of the electronic package substrate being a stiff sheet of adhesive that is substantially not sticky and after curing said bonding member having mechanical and chemical adhesive bonds with the circuitized member. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. An electronic package substrate for an electronic package, comprising:
-
an adhesive bonding member having two planar surfaces and an orifice there through for receiving a chip; and a circuitized member having two planar surfaces, one surface being bonded to one of the planar surfaces of the bonding member, said circuitized member being electrically connectable to the chip wherein the bonding member is electrically conductive and is fabricated with silver particles therein.
-
-
8. An electronic package substrate for an electronic package comprising:
-
an adhesive bonding member having two planar surfaces, and an orifice there through for receiving a chip; and a circuitized member having two planar surfaces one surface being bonded to one of the planar surface of the bonding member, said circuitized member being electrically connectable to the chip further including a support member bonded to a planar surface of the bonding member.
-
-
9. An electronic package substrate for an electronic package, comprising
an adhesive bonding member having two planar surfaces and an orifice there through; -
a circuitized member bonded to one of the surfaces and having an orifice there through overlying the orifice in the bonding member; and a support member bonded to the other planar surface, blocking the orifices, and thereby forming a cavity in the substrate for receiving a chip. - View Dependent Claims (10, 11, 12, 13)
-
-
14. An electronic package substrate for an electronic package, comprising:
-
an adhesive bonding member having two planar surfaces and an orifice there through, prior to bonding said bonding member being solid and substantially rigid; a circuitized member bonded to one of the planar surfaces and having an orifice there through overlying the orifice in the bonding member; and a support member bonded to the other planar surface, blocking the orifices, and thereby forming a cavity in the substrate for receiving a chip. - View Dependent Claims (15)
-
-
16. An array of electronic package substrates, comprising
adhesive bonding members each having two planar surfaces and an orifice there through; -
circuitized members each bonded to one of the planar surfaces and having an orifice there through each overlying the orifices in the bonding members; support members each bonded to the other planar surface, blocking the orifices, and thereby forming cavities in the substrates for receiving a chip; and a frame surrounding end connecting the bonding members.
-
-
17. An electronic package, comprising:
-
an adhesive bonding member having two planar surfaces and an orifice there through; a circuitized member bonded to one of the planar surfaces and having an orifice there through overlying the orifice in the bonding member; a support member bonded to the other planar surface, blocking the orifices and forming a cavity; and a chip bonded within the cavity to the support member. - View Dependent Claims (18, 19)
-
-
20. An electronic package substrate for an electronic package, comprising:
-
an adhesive bonding member having two planar surfaces and an orifice there through; a circuitized member bonded to one of the planar surfaces and having an orifice there through overlying the orifice in the bonding member; an electrically conductive, support member bonded to the other planar surface, blocking the orifices and forming a cavity for receiving a chip; and an electrical conductor electrically connecting the support member such that when the support member and the conductor are pounded, chip within the cavity is shielded from exterior fields. - View Dependent Claims (21, 22, 23, 24)
-
-
25. An electronic package substrate for an electronic package, comprising:
-
an adhesive bonding member having two planar surfaces and an orifice there through, said bonding member having an upper and a lower electrically conductive cladding connected by an electrically conducting via and said bonding member otherwise being electrically non-conductive; a circuitized member bonded to one on the planar surfaces and having an orifice there through overlying the orifice in the bonding member; an electrically conductive, support member bonded to the other planar surface, blocking the orifices and forming a cavity for receiving a chip; and a electrical conductor electrically connecting the support members such that when the support member and the conductor are grounded, a chip within the cavity is shielded from exterior fields. - View Dependent Claims (26)
-
-
27. An electronic package substrate for an electronic package for a flip chip, comprising:
-
an adhesive bonding member having two planar surfaces and an orifice there through; a circuitized member bonded to one of the planar surfaces and blocking the orifice, thereby forming a cavity for receiving a flip chip, said bonding member prior to assembly of the electronic package substrate being a stiff of adhesive that is substantially not sticky and after curing said bonding member having mechanical and chemical adhesive bonds with the circuitized member; and an array of solder pads on the circuitized member within the cavity. - View Dependent Claims (28, 29)
-
-
30. An electronic package for a flip chip, comprising:
-
an adhesive bonding member having two planar surfaces and an orifice there through; a circuitized member bonded to one of the planar surfaces and blocking the orifice, thereby forming a cavity, said bonding member prior to assembly of the electronic package substrate being a stiff sheet of adhesive that is substantially not sticky and after curing said bonding member having mechanical and chemical adhesive bonds within the circuitized member; an array of solder pads on the circuitized member within the cavity; and a flip chip mounted within the cavity and electrically connected to the solder pads. - View Dependent Claims (31, 32, 33, 34, 35)
-
-
36. An electronic package for a flip chip, comprising:
-
an adhesive bonding member having two planar surfaces and an orifice there through; a circuitized member bonded to one of the planar surfaces and blocking the orifice, thereby forming a cavity; an array of solder pads on the circuitized member within the cavity; and a flip chip mounted within the cavity and electrically connected to the solder pads, further including an array of solder bumps on the flip chip and array of solder balls on the circuitized member, said balls melt at least about 20 C. lower than the bumps.
-
-
37. An electronic package for a flip chip comprising:
-
an adhesive bonding member having two planar surfaces and an orifice there through; a circuitized member bonded to one of the planar surfaces and blocking the orifice, thereby forming a cavity; an array of solder pads on the circuitized member within the cavity; and a flip chip mounted within the cavity and electrically connected to the solder pads, further including an induction heating concentrator operatively connected to the package by a magnetic field.
-
-
38. A flip chip package substrate strip of electronic package substrates, comprising:
-
an array of electronic package substrates, each substrate having an adhesive bonding member having two planar surfaces and an orifice there through; a circuitized member bonded to one of the planar surfaces and blocking the orifice, thereby forming a cavity for receiving a flip chip; and an array of solder pads on the circuitized member, within the cavity; and a substrate frame surrounding each electronic package substrate, said frame is a support for the flip chip package substrate strip. - View Dependent Claims (39, 40, 41)
-
-
42. An electronic package substrate for an electronic package, comprising:
-
an adhesive bonding member having two planar surfaces and an orifice there through, said bonding member having an upper and a tower electrically conductive cladding connected by an electrically conducting via; a circuitized member bonded to one of the planar surfaces and orifice there through overlying the orifice in the bonding member, said circuitized member being dimensioned to form a ledge on the upper cladding of the bonding member, said upper cladding having a metallized layer so which wire bonds from a chip may be attached for grounding a circuit within the chip; an electrically conductive, support member bonded to the other planar surface, blocking the orifices and forming a cavity the receiving a chip; and an electrical conductor electrically connecting the support member such that when the member and the conductor are grounded, a chip within the cavity is shielded from exterior fields.
-
Specification