Keypad assembly
First Claim
Patent Images
1. A keypad assembly, comprising:
- a substrate;
a force sensor disposed on the substrate; and
an encapsulation layer molded onto the substrate over the force sensor, the substrate and force sensor being at least partially encapsulated by the encapsulation layer so that the force sensor is sandwiched between the substrate and encapsulation layer,wherein the force sensor is suitable for sensing a force applied to the encapsulation layer over to the force sensor for registering a key press to the keypad assembly and wherein the force sensor includes means for canceling preload forces placed on the force sensor by molding of the encapsulation layer.
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Abstract
A keypad assembly utilizes touch-detecting apparatus such as force sensors or touchpad assemblies for registering key presses. In exemplary embodiments, the keypad assembly is suitable for use in electronic devices such as a mobile telephones, calculators, hand-held computers, or the like, having single piece molded housings wherein the keypad assembly is at least partially encapsulated within the housing.
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Citations
31 Claims
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1. A keypad assembly, comprising:
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a substrate; a force sensor disposed on the substrate; and an encapsulation layer molded onto the substrate over the force sensor, the substrate and force sensor being at least partially encapsulated by the encapsulation layer so that the force sensor is sandwiched between the substrate and encapsulation layer, wherein the force sensor is suitable for sensing a force applied to the encapsulation layer over to the force sensor for registering a key press to the keypad assembly and wherein the force sensor includes means for canceling preload forces placed on the force sensor by molding of the encapsulation layer. - View Dependent Claims (2, 3, 4, 21)
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5. A keypad assembly, comprising:
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means for sensing a force; means for supporting the force sensing means; and means, molded onto the supporting means, for encapsulating the substrate and force sensing means, the force sensing means being sandwiched between the encapsulating means and the supporting means, wherein the force sensing means is suitable for sensing a force applied to the encapsulating means over to the force sensing means for registering a key press to the keypad assembly and wherein the means for sensing a force includes means for canceling preload forces placed on the force sensor by molding of the encapsulation means. - View Dependent Claims (6, 7)
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8. An electronic device, comprising:
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a keypad including a substrate and a force sensor disposed on the substrate; and a housing molded onto the substrate so that the force sensor is at least partially encapsulated by the housing, the force sensor being sandwiched between the housing and the substrate for at least substantially eliminating spaces between the housing and the force sensor and the force sensor and the substrate, wherein the force sensor is suitable for sensing a force applied to a portion of the housing over to the force sensor for registering a key press of the keypad and wherein the force sensor includes means for canceling preload forces placed on the force sensor by molding of the encapsulation housing. - View Dependent Claims (9, 10, 11, 22)
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12. A mobile telephone, comprising:
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a keypad including a substrate and a force sensor disposed on the substrate; and a housing molded onto the substrate so that the force sensor is at least partially encapsulated by the housing so that spaces between the housing and force sensor and the force sensor and the substrate are at least substantially eliminated, wherein the force sensor is suitable for detecting a force applied to a portion of the housing over to the force sensor for registering a key press of the keypad and wherein the force sensor includes means for canceling preload forces placed on the force sensor by molding of the encapsulation housing. - View Dependent Claims (13, 14, 15, 23)
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16. A method for manufacturing a keypad assembly, comprising:
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assembling a keypad, the keypad including a substrate having a force sensor disposed thereon for sensing a force applied thereto and registering a key press, and having a means for canceling preload forces placed on the force sensor; overmolding an encapsulation layer onto the keypad so that the substrate and force sensor are at least partially encapsulated within the encapsulation layer, the force sensor being sandwiched between the housing and the substrate for at least substantially eliminating spaces between the housing and the force sensor and the force sensor and the substrate; and canceling preload forces on the force sensor from the encapsulation layer. - View Dependent Claims (17, 18, 19, 20)
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24. A keypad assembly, comprising:
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a substrate; a force sensor disposed on the substrate; and an encapsulation layer molded onto the substrate over the force sensor without formation of a compressible key dome, the substrate and force sensor being at least partially encapsulated by the encapsulation layer so that the encapsulation layer is in continuous contact with the force sensor, wherein the force sensor is suitable for sensing a force applied to the encapsulation layer over to the force sensor for registering a key press to the keypad assembly and wherein the force sensor includes means for canceling preload forces placed on the force sensor by molding of the encapsulation layer. - View Dependent Claims (25, 26, 27)
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28. A keypad assembly, comprising:
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a substrate; a force sensor disposed on the substrate; and an encapsulation layer molded onto the substrate over the force sensor, the substrate and force sensor being at least partially encapsulated by the encapsulation layer so that the force sensor is sandwiched between the housing and the substrate for eliminating spaces between the encapsulating layer and force sensor and the force sensor and the substrate, wherein the force sensor is suitable for sensing a force applied to the encapsulation layer over the force sensor for registering a key press to the keypad assembly and wherein the force sensor includes means for canceling preload forces placed on the force sensor by molding of the encapsulation layer. - View Dependent Claims (29, 30, 31)
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Specification