Methods of operating microelectronic devices, and methods of providing microelectronic devices
First Claim
1. A method comprising:
- disposing an integrated circuit die within a microelectronic package, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry including first transponder circuitry configured to transmit and receive radio frequency signals, wherein the integrated circuit die is void of external electrical connections for anything except power supply external connections; and
disposing second transponder circuitry, discrete from the first transponder circuitry, within the microelectronic package, the second transponder circuitry being configured to transmit and receive radio frequency signals, wherein the first and second transponder circuitry are configured to establish wireless communication between one another within the microelectronic package.
3 Assignments
0 Petitions
Accused Products
Abstract
Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices are described. In one embodiment, a microelectronic device includes a microelectronic package which provides a housing within which integrated circuitry is received. An integrated circuit die is received within the microelectronic package and includes integrated circuitry formed thereon. The integrated circuitry comprises first transmit/receive circuitry configured to transmit and receive radio frequency signals. Second transmit/receive circuitry is provided, discrete from the first transmit/receive circuitry, and is contained within the microelectronic package. The second circuitry is configured to transmit and receive radio frequency signals, wherein the first and second transmit/receive circuitry are configured to establish wireless communication between one another within the microelectronic package. In another embodiment, a microelectronic package is provided having housed therein integrated circuitry. Wireless communication is produced using a transmitter inside the microelectronic package. The produced wireless communication is received using a receiver inside the microelectronic package. Responsive to the receiving of such communication, the integrated circuitry is caused to operate in a designed manner.
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Citations
35 Claims
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1. A method comprising:
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disposing an integrated circuit die within a microelectronic package, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry including first transponder circuitry configured to transmit and receive radio frequency signals, wherein the integrated circuit die is void of external electrical connections for anything except power supply external connections; and disposing second transponder circuitry, discrete from the first transponder circuitry, within the microelectronic package, the second transponder circuitry being configured to transmit and receive radio frequency signals, wherein the first and second transponder circuitry are configured to establish wireless communication between one another within the microelectronic package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method comprising:
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disposing an integrated circuit die within a microelectronic package and supporting the die by an integrated circuitry-supporting substrate inside the package, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry having first transponder circuitry configured to transmit and receive wireless communications, the integrated circuit die having physical-electrical connection structure securing it to the integrated circuitry-supporting substrate and providing electrical connections only for supply of power to the die; disposing second transponder circuitry, discrete from the first transponder circuitry, within the package, the second transponder circuitry being configured to transmit and receive wireless communications; and causing the first and second transponder circuitry to establish wireless communications between one another within the microelectronic package. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. A method of operating a microelectronic device comprising:
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mounting a transmitter integrated circuit within a microelectronic package, wherein the transmitter integrated circuit is void of external electrical connections for anything except power supply external connections; mounting an integrated circuit receiver within the package; transmitting a wireless communication using the transmitter; receiving the produced wireless communication using the receiver inside the microelectronic package; and responsive to said receiving, causing integrated circuitry separate from the transmitter and receiver to operate. - View Dependent Claims (23, 24, 25, 26)
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27. A method of operating a microelectronic device comprising:
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transmitting a wireless communication signal using an integrated circuitry transmitter inside a microelectronic package, the transmitter being void of external electrical connections other than power supply external electrical connections; receiving the transmitted wireless communication signal using an integrated circuitry receiver inside the microelectronic package; and responsive to said receiving, causing the integrated circuitry within the microelectronic package to operate. - View Dependent Claims (28, 29, 30, 31)
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32. A method of forming a microelectronic device comprising:
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mounting an integrated circuitry transmitter within a microelectronic package; and mounting an integrated circuit die within the package, wherein the integrated circuit die has physical-electrical connection structure securing it within the package, said structure providing electrical connections for power only the die having integrated circuitry disposed thereon including an integrated circuit receiver, wherein the transmitter and receiver are configured to establish direct wireless communication with one another, wherein operating instructions for the integrated circuitry on the die are transmitted and received within the microelectronic package. - View Dependent Claims (33, 34, 35)
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Specification