Modular mounting arrangement and method for light emitting diodes

• US 7,108,396 B2
• Filed: 08/02/2004
• Issued: 09/19/2006
• Est. Priority Date: 06/29/2001
• Status: Expired due to Fees

• Current Assignee: Permlight Products Inc
• Original Assignee: Permlight Products Inc
• Inventors: Swaris, Jagath, Ness, Scott Van
• Primary Examiner(s): O'Shea, Sandra
• Assistant Examiner(s): Tsidulko, Mark
• Application Number:
  US10/909,933
• Publication Number:
  US 20050063183A1
• Time in Patent Office: 778 Days
• Field of Search: 362/249, 362/250, 362/231, 362/226, 362/294, 362/373, 362/800, 362/640, 362/394, 257/88, 257/91, 257/99, 257/103
• US Class Current: 362/249.06
• CPC Class Codes: F21S 4/20 with light sources held by or within elongate supports
• CPC Class Codes: F21V 17/007 with provision for shipment or storage
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G09F 13/0404 the light source being enclosed in a box forming the character of the sign
• CPC Class Codes: G09F 13/22 electroluminescent electroluminescent light sources per se H05B33/00
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/13 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs away from the LEDs. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. An adhesive connects the LED module to the mount surface. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.

Claims

1. A method of making an illuminated signage system, comprising:

providing a sign member configured according to a desired illumination shape;

providing a plurality of light emitting diode (LED) modules, each of the LED modules comprising;

a plurality of LEDs;

a plurality of electrically conductive contacts, each of the LEDs electrically communicating with at least one of the contacts;

a dielectric layer having a first side and a second side, the contacts being connected to the first side; and

a heat conductive body communicating with the second side of the dielectric layer, the heat conductive body configured to absorb heat generated by the LEDs;

providing an adhesive portion configured to connect the LED module to the sign member, the heat conductive body being disposed between the dielectric layer and the adhesive portion;

electrically connecting the plurality of LED modules to each other; and

adhering the adhesive portion of each module to a surface of the sign member.

2. The method of claim 1, wherein the adhesive portion comprises a thermally conductive tape.

3. The method of claim 2, wherein the tape comprises a backing, and additionally comprising removing the backing to expose the adhesive layer.

4. The method of claim 2, wherein the adhesive is attached directly to the heat conductive body.

5. The method of claim 1, wherein the heat conductive body has a thermal conductivity greater than about 100 W/mK.

6. The method of claim 5, wherein the sign member has a thermal conductivity greater than about 100 W/mK.

7. The method of claim 5, wherein the heat conductive body is substantially flat.

8. The method of claim 7, wherein the heat conductive body comprises aluminum.

9. The method of claim 1, wherein at least some of the plurality of modules are arranged electrically in parallel.

10. The method of claim 9, wherein the plurality of LEDs on each LED module are arranged electrically in series on the module.

11. The method of claim 1 additionally comprising electrically connecting the modules to one another before adhering them to the sign member.

12. The method of claim 11 additionally comprising forming a linear chain of modules by electrically connecting adjacent modules.

13. The method of claim 1, wherein the modules are arranged in a dispenser, and additionally comprising drawing successive modules from the dispenser and adhering them into place on the sign member.

14. A method of making an illuminated signage system, comprising:

providing a sign member configured according to a desired illumination shape;

providing a plurality of light emitting diode (LED) modules that are electrically interconnected in an electrically parallel arrangement, each of the LED modules comprising;

at least one LED;

a plurality of electrically conductive contacts, the at least one LED electrically communicating with at least one of the contacts;

a dielectric layer having a first side and a second side, the contacts being disposed on the first side;

a heat conductive body communicating with the second side of the dielectric layer, the heat conductive body configured to absorb heat generated by the LEDs;

providing an adhesive portion configured to connect the LED module to the sign member, the heat conductive body being disposed between the dielectric layer and the adhesive portion; and

adhering the adhesive portion of each module to a surface of the sign member.

15. The method of claim 14, wherein the adhesive portion comprises a thermally conductive tape.

16. The method of claim 15, wherein at least part of the adhesive portion extends outwardly beyond a side edge of the LED module.

17. The method of claim 15, wherein the adhesive is attached directly to the heat conductive body.

18. The method of claim 17, wherein the adhesive on the body is adhered directly to a surface of the sign member.

19. The method of claim 14 additionally comprising connecting the LED modules to one another before adhering them to the sign member.

20. The method of claim 19 additionally comprising forming a linear chain of modules by electrically connecting adjacent modules.

21. The method of claim 14, wherein the LED modules are arranged in a dispenser, and additionally comprising drawing successive modules from the dispenser and adhering them into place on the sign member.

22. The method of claim 21, wherein the dispenser comprises a container, and the interconnected modules are arranged to overlap each other within the container so as to form a serpentine stack of modules within the container.

23. The method of claim 21, wherein the dispenser comprises a reel, and the interconnected modules are wound about the reel.

24. The method of claim 21, wherein the adhesive portion comprises a tape having a backing, and adhering the adhesive portion to a surface comprises removing the backing and placing the module on the surface.

25. The method of claim 14, wherein each module comprises a substantially flat circuit board, the circuit board comprising a flat main body, the dielectric layer, and the contacts, the flat main body being directly connected to the second side of the dielectric layer.

26. The method of claim 25, wherein contacts are arranged only on the first side of the dielectric layer.

27. The method of claim 26, wherein the heat conductive body comprises a metal.

28. The method of claim 27, wherein the heat conductive body has a unitary structure.

29. The method of claim 27, wherein the heat conductive body comprises the circuit board.