Heat sinks
First Claim
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1. An organic electronic device comprising a heat sink, wherein:
- the heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink;
the heat sink has a thickness no greater than 9 mm; and
the heat sink is attached to an array within the organic electronic device.
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Abstract
An aspect of the present invention provides a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a thickness no greater than 9 mm. In another embodiment, a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a ratio of area:thickness, as seen from a plan view, of at least 500:1 when the area and thickness are expressed in units of mm2 and mm, respectively.
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Citations
14 Claims
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1. An organic electronic device comprising a heat sink, wherein:
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the heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink; the heat sink has a thickness no greater than 9 mm; and the heat sink is attached to an array within the organic electronic device. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An organic electronic device comprising a heat sink, wherein:
- the heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink;
the heat sink has a ratio of area;
thickness, as seen from a plan view, of at least 500;
1 when the area and thickness are expressed in units of mm2 and mm, respectively; andthe heat sink is attached to an array within the organic electronic device. - View Dependent Claims (9, 10, 11, 12, 13, 14)
- the heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink;
Specification