High Ion/Ioff SOI MOSFET using body voltage control
First Claim
1. A silicon-on-insulator (SOI) device, comprising:
- a body region disposed between source and drain regions in a layer of silicon over an insulator,a gate disposed in insulated relationship to the body region and operable under bias to effect a conductivity within the body region;
the body region comprising a channel portion proximate the gate and a floating body portion more distal the gate; and
an extra dopant region against one of the source and the drain regions, the extra dopant region of a conductivity type opposite that of the one of the source and the drain regions;
wherein the extra dopant region is separate and non-contiguous to the body region and separated therefrom by at least a portion of the one of the source and the drain regions; and
the body region comprises a doping profile to assist the injection of carriers into the floating body portion of the body region.
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0 Petitions
Accused Products
Abstract
A semiconductor device may comprise a partially-depleted SOI MOSFET having a floating body region disposed between a source and drain. The floating body region may be driven to receive injected carriers for adjusting its potential during operation of the MOSFET. In a particular case, the MOSFET may comprise another region of semiconductor material in contiguous relationship with a drain/source region of the MOSFET and on a side thereof opposite to the body region. This additional region may be formed with a conductivity of type opposite the drain/source, and may establish an effective bipolar device per the body, the drain/source and the additional region. The geometries and doping thereof may be designed to establish a transport gain of magnitude sufficient to assist the injection of carriers into the floating body region, yet small enough to guard against inter-latching with the MOSFET.
127 Citations
14 Claims
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1. A silicon-on-insulator (SOI) device, comprising:
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a body region disposed between source and drain regions in a layer of silicon over an insulator, a gate disposed in insulated relationship to the body region and operable under bias to effect a conductivity within the body region; the body region comprising a channel portion proximate the gate and a floating body portion more distal the gate; and an extra dopant region against one of the source and the drain regions, the extra dopant region of a conductivity type opposite that of the one of the source and the drain regions; wherein the extra dopant region is separate and non-contiguous to the body region and separated therefrom by at least a portion of the one of the source and the drain regions; and the body region comprises a doping profile to assist the injection of carriers into the floating body portion of the body region. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor-on-insulator (SOI) device, comprising:
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a layer of semiconductor material over an insulator; a body region disposed between source and drain regions in the layer of semiconductor material; a gate disposed in insulated relationship to the body region and operable under bias to effect a conductivity within the body region; the body region comprising a channel portion proximate the gate and a floating body portion more distal the gate; an extra dopant region against one of the source and the drain regions and of a conductivity type opposite that of the one of the source and the drain regions; the one of the source and the drain regions disposed between the extra dopant region and the body region comprising a doping profile to assist injection of carriers into the floating body portion of the body region; and a thyristor for a memory cell defined at least in part within the layer of semiconductor material; wherein the source, the body and the drain regions in combination with the gate define at least in part an access transistor by which to access the thyristor; and the extra dopant region defines part of the thyristor. - View Dependent Claims (8)
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9. A semiconductor-on-insulator (SOI) device, comprising:
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a layer of semiconductor material over an insulator for an SOI structure; a thyristor comprising anode-emitter, N-base, P-base, and cathode-emitter regions in the layer of semiconductor material; a MOSFET transistor disposed electrically in series with the thyristor, the MOSFET transistor comprising a body region disposed between source and drain regions in the semiconductor material; and a gate electrode disposed in insulated relationship to the body region and configured to receive a bias signal operable to effect a conductivity within the body region; wherein the body region comprises a channel portion proximate the gate electrode and a floating body portion distal the gate electrode; and the cathode-emitter region for the thyristor is formed in common with one of the source and the drain regions to the MOSFET transistor, and comprises a doping profile to assist injection of carriers into the floating body portion of the body region. - View Dependent Claims (10, 11, 12, 13, 14)
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Specification