Hermetically sealed package for optical, electronic, opto-electronic and other devices
First Claim
1. A method of hermetically sealing one or more devices within a package, the method comprising:
- attaching a lid to a semiconductor substrate on which the one or more devices are provided such that the one or more devices are encapsulated within an area defined by the semiconductor substrate and the lid;
introducing a substance via a through-hole in the lid to a region that is separated from the one or more devices by a wall having an opening through which the substance can pass to the one or more devices; and
hermetically sealing the through-hole.
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Abstract
Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A substance, such as a lubricant or gas, is introduced via one or more through-holes in the lid to a region that is separated from the devices by a wall having at least one opening through which the substance can pass to the devices. The through-hole then may be hermetically sealed, for example, using a local heating process that does not degrade the lubricant or other substance.
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Citations
15 Claims
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1. A method of hermetically sealing one or more devices within a package, the method comprising:
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attaching a lid to a semiconductor substrate on which the one or more devices are provided such that the one or more devices are encapsulated within an area defined by the semiconductor substrate and the lid; introducing a substance via a through-hole in the lid to a region that is separated from the one or more devices by a wall having an opening through which the substance can pass to the one or more devices; and hermetically sealing the through-hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of hermetically sealing one or more devices within a package, the method comprising:
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attaching a lid to a substrate on which the one or more devices are provided such that the one or more devices are encapsulated within an area defined by the substrate and the lid; introducing a substance via a through-hole in the lid to a region that is separated from the one or more devices by a wall having an opening through which the substance can pass to the one or more devices; and hermetically sealing the through-hole, wherein the substance comprises a lubricant and further wherein at least some of the lubricant evaporates and passes through the opening to the one or more devices.
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15. A method of hermetically sealing one or more devices within a package, the method comprising:
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attaching a lid to a substrate on which the one or more devices are provided such that the one or more devices are encapsulated within an area defined by the substrate and the lid; introducing a substance via a through-hole in the lid to a region that is separated from the one or more devices by a wall having an opening through which the substance can pass to the one or more devices; hermetically sealing the through-hole; and passing an optical signal through the lid to or from the one or more devices.
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Specification