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Power management for spatial power combiners

  • US 7,110,165 B2
  • Filed: 10/29/2002
  • Issued: 09/19/2006
  • Est. Priority Date: 10/29/2002
  • Status: Active Grant
First Claim
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1. An integrated, spatial power-combining system, comprising:

  • (a) a spatial power-combining chip having(i) a front surface with a plurality of active devices disposed thereon, and(ii) a back surface with patterned, electrically-conductive material disposed thereon; and

    (b) a thermally-conductive, dielectric substrate having a front surface attached to the back surface of the spatial power-combining chip.

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