Light emitting device and method of manufacturing the same

• US 7,112,115 B1
• Filed: 11/07/2000
• Issued: 09/26/2006
• Est. Priority Date: 11/09/1999
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Konuma, Toshimitsu, Nishi, Takeshi, Yamazaki, Shunpei
• Primary Examiner(s): Guharay, Karabi
• Application Number:
  US09/707,862
• Time in Patent Office: 2,149 Days
• Field of Search: 445 24- 25, 313/512
• US Class Current: 445/25
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/8428 Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/851 Division of substrate

Abstract

Technology to reduce the manufacturing cost of a manufacturing process of a light emitting device is provided. The manufacturing cost of a device using a light emitting element can be reduced by using a multilayout process for forming a plurality of light emitting devices from a large-sized substrate. In particular, an existing line for manufacturing liquid crystal cells can be diverted to a process of encapsulating light emitting elements, which can greatly reduce the manufacturing cost including the investment in plant and equipment.

Claims

1. A method of manufacturing a light emitting device, comprising:

forming a sealing material so as to surround at least a light emitting element over an insulator;

adhering a covering material to said insulator by said sealing material;

cutting a first part of said insulator and a first part of said covering material after said step of adhering said covering material;

injecting an encapsulant in a portion surrounded by said insulator, said covering material, and said sealing material; and

cutting a second part of said insulator and a second part of said covering material after said step of injecting said encapsulant.

2. A method according to claim 1, further comprising scattering a spacer over the insulator before or after the sealing material is formed.

3. A method according to claim 1, wherein the encapsulant comprises a resin.

4. A method according to claim 1, wherein a hygroscopic substance is added to the encapsulant.

5. A method of manufacturing a light emitting device, comprising:

forming a first sealing material so as to surround at least a light emitting element over an insulator;

adhering a covering material to said insulator by said first sealing material;

cutting a first part of said insulator and a first part of said covering material after said step of adhering said covering material;

injecting an encapsulant in a portion surrounded by said insulator, said covering material, and said first sealing material;

cutting a second part of said insulator and a second part of said covering material after said step of injecting said encapsulant;

attaching a connecting terminal over said insulator; and

forming a second sealing material so as to abut an exposed portion of said first sealing material and a part of said connecting terminal.

6. A method according to claim 5, further comprising scattering a spacer over the insulator before or after the first sealing material is formed.

7. A method according to claim 5, wherein the encapsulant comprises a resin.

8. A method according to claim 5, wherein a hygroscopic substance is added to the encapsulant.

9. A method of manufacturing a light emitting device, comprising:

forming a sealing material so as to surround at least a light emitting element over an insulator;

dropping encapsulant over said light emitting element;

adhering a covering material to said insulator by said sealing material after said step of dropping said encapsulant, wherein the cover material is in contact with the sealing material; and

cutting a part of said insulator and a part of said covering material after said step of adhering said covering material.

10. A method according to claim 9, further comprising scattering a spacer over the insulator before or after the sealing material is formed.

11. A method according to claim 9, wherein the encapsulant comprises a resin.

12. A method according to claim 9, wherein a hygroscopic substance is added to the encapsulant.

13. A method of manufacturing a light emitting device, comprising:

forming a first sealing material so as to surround at least a light emitting element over a surface of a substrate;

dropping encapsulant over said light emitting element;

adhering a covering material to said substrate by said first sealing material after said step of dropping said encapsulant, wherein the cover material is in contact with the first sealing material;

cutting a part of said substrate and a part of said covering material after said step of adhering said covering material;

attaching a connecting terminal over said substrate; and

forming a second sealing material so as to abut an exposed portion of said first sealing material and a part of said connecting terminal.

14. A method according to claim 13, further comprising scattering a spacer over the substrate before or after the first sealing material is formed.

15. A method according to claim 13, wherein the encapsulant comprises a resin.

16. A method according to claim 13, wherein a hygroscopic substance is added to the encapsulant.