Structure and method of a strained channel transistor and a second semiconductor component in an integrated circuit
First Claim
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1. A method of forming a semiconductor chip, the method comprising:
- providing a semiconductor region comprising a first semiconductor material with a first natural lattice constant;
forming first and second active regions in the semiconductor region;
forming a first gate stack over the second active region;
forming first spacers adjacent the first gate stack;
forming a masking layer over the first active region;
after forming the masking layer, forming at least one recess in a portion of the second active region not covered by the first gate stack;
forming a second semiconductor material in the at least one recess to substantially fill the at least one recess, the second semiconductor material having a second natural lattice constant that is different than the first natural lattice constant;
forming heavily-doped source and drain regions in the second active region on opposing sides of the first gate stack;
removing the first spacers after the forming heavily-doped source and drain regions;
forming lightly-doped drains after the removing the first spacers on opposing sides of the first gate stack;
removing the masking layer; and
forming a semiconductor component in the first active region.
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Abstract
A semiconductor chip includes a semiconductor substrate 126, in which first and second active regions are disposed. A resistor 124 is formed in the first active region and the resistor 124 includes a doped region 128 formed between two terminals 136. A strained channel transistor 132 is formed in the second active region. The transistor includes a first and second stressor 141, formed in the substrate oppositely adjacent a strained channel region 143.
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Citations
71 Claims
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1. A method of forming a semiconductor chip, the method comprising:
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providing a semiconductor region comprising a first semiconductor material with a first natural lattice constant; forming first and second active regions in the semiconductor region; forming a first gate stack over the second active region; forming first spacers adjacent the first gate stack; forming a masking layer over the first active region; after forming the masking layer, forming at least one recess in a portion of the second active region not covered by the first gate stack; forming a second semiconductor material in the at least one recess to substantially fill the at least one recess, the second semiconductor material having a second natural lattice constant that is different than the first natural lattice constant; forming heavily-doped source and drain regions in the second active region on opposing sides of the first gate stack; removing the first spacers after the forming heavily-doped source and drain regions; forming lightly-doped drains after the removing the first spacers on opposing sides of the first gate stack; removing the masking layer; and forming a semiconductor component in the first active region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A method of forming a semiconductor device, the method comprising:
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providing a semiconductor substrate comprising a first semiconductor material, the substrate including a first active region and a second active region, the first active region having a first gate stack formed thereon and the second active region having a second gate stack farmed thereon; forming a film over first active region and second active region; forming spacers on sidewalls of the second gate stack in the second active region; etching a source recess and a drain recess on opposing sides of the second gate stack, the source recess and the drain recess spaced from a channel region by the spacers; growing a second semiconductor material in the source recess and the drain recess; forming heavily-doped regions on opposing sides of the second gate stack; removing the spacers after forming the heavily-doped regions; and forming lightly-doped regions on opposing sides of the second gate stack after removing the spacers. - View Dependent Claims (35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64)
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65. A method of forming a semiconductor device, the method comprising;
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providing a semiconductor layer that includes a first active region and a second active region; forming a first gate stack over the first active region and a second gate stack over the second active region; forming a dielectric film over the first active region and the second active region; forming a masking layer over a portion of the dielectric film overlying the second active region; forming disposable spacers on sidewalls of the first gate stack by anisotropically etching the dielectric film; forming first and second recesses in the first active region substantially aligned with the disposable spacer; filling the first and second recesses with a semiconductor material; implanting source and drain regions in the second active region adjacent the second gate stack; removing the disposable spacers; and forming lightly-doped drains on opposing sides of the first gate stack after removing the disposable spacers. - View Dependent Claims (66, 67, 68, 69, 70, 71)
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Specification